H01J 37/32174
Circuits specially adapted for controlling the rf discharge
Official title: {Circuits specially adapted for controlling the RF discharge}
H01J37/32174 (Circuits specially adapted for controlling the rf discharge) appears on 2,288 US grants and 2,977 published applications in this corpus.
Search patents in H01J- Granted patents
- 2,288
- Published applications
- 2,977
- Assignees
- 360
- Inventors
- 3,578
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 13 | 0 |
| 1996 | 11 | 0 |
| 1997 | 11 | 0 |
| 1998 | 12 | 0 |
| 1999 | 15 | 0 |
| 2000 | 25 | 0 |
| 2001 | 33 | 12 |
| 2002 | 30 | 42 |
| 2003 | 27 | 43 |
| 2004 | 37 | 57 |
| 2005 | 24 | 54 |
| 2006 | 33 | 36 |
| 2007 | 32 | 67 |
| 2008 | 24 | 51 |
| 2009 | 29 | 60 |
| 2010 | 35 | 58 |
| 2011 | 41 | 58 |
| 2012 | 45 | 49 |
| 2013 | 42 | 57 |
| 2014 | 39 | 78 |
| 2015 | 68 | 91 |
| 2016 | 80 | 103 |
| 2017 | 99 | 121 |
| 2018 | 96 | 123 |
| 2019 | 141 | 171 |
| 2020 | 160 | 222 |
| 2021 | 150 | 219 |
| 2022 | 153 | 217 |
| 2023 | 162 | 246 |
| 2024 | 208 | 253 |
| 2025 | 211 | 297 |
| 2026 | 161 | 192 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High power generator and method of supplying high power pulses6 Oct 2026US 12,755,932 B2Trumpf Huettinger Sp. Z O. O.
- High power generator and method of supplying high power pulses6 Oct 2026US 12,755,933 B2Trumpf Huettinger Sp. Z O. O.
- Pulsed voltage waveform with binary pulses for biasing of plasma6 Oct 2026US 12,755,934 B2APPLIED Materials.Inc.
- Process control for ion energy delivery using multiple generators and phase control6 Oct 2026US 12,755,935 B2Lam Research Corporation
- System and method for delivering pulsed RF power from a single generator to multiple loads6 Oct 2026US 12,755,936 B2Inspiring Atoms Pte Ltd
- Plasma processing apparatus, power source system, and plasma processing method8 Oct 2026US 2026/0311967 A1Tokyo Electron Limited
- Rf impedance matching network8 Oct 2026US 2026/0311968 A1ASM America, Inc.
- Rf impedance matching network with series-connected diode switches1 Oct 2026US 2026/0302137 A1ASM America, Inc.
- Metrology Enclosure Including Spectral Reflectometry System for Plasma Processing System Using Direct-Drive Radiofrequency Power Supply1 Oct 2026US 2026/0302144 A1Lam Research Corporation
- Impedance matcher1 Oct 2026US 2026/0303052 A1DAIHEN Corporation
Most cited
By later US patents
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Low temperature CVD process with selected stress of the CVD layer on CMOS devices559US 7,393,765 B2APPLIED Materials.Inc. · 2008
- Plasma monitoring and control method and system503US 5,939,886 AAdvanced Energy Industries, Inc. · 1999
- Plasma processing apparatus and method485US 7,951,262 B2Tokyo Electron Limited · 2011
- Film forming method and film forming apparatus473US 8,586,484 B2Fuji Electric Co., Ltd. · 2013