H01J 2237/30466
Detecting endpoint of process
H01J2237/30466 (Detecting endpoint of process) appears on 112 US grants and 107 published applications in this corpus.
Search patents in H01J- Granted patents
- 112
- Published applications
- 107
- Assignees
- 63
- Inventors
- 282
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 3 |
| 2005 | 7 | 3 |
| 2006 | 0 | 7 |
| 2007 | 1 | 3 |
| 2008 | 1 | 6 |
| 2009 | 4 | 5 |
| 2010 | 4 | 7 |
| 2011 | 7 | 3 |
| 2012 | 5 | 6 |
| 2013 | 3 | 4 |
| 2014 | 4 | 4 |
| 2015 | 5 | 4 |
| 2016 | 7 | 5 |
| 2017 | 7 | 2 |
| 2018 | 3 | 1 |
| 2019 | 5 | 6 |
| 2020 | 5 | 8 |
| 2021 | 9 | 7 |
| 2022 | 5 | 5 |
| 2023 | 4 | 7 |
| 2024 | 1 | 3 |
| 2025 | 6 | 2 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- End point determination by means of contrast gas29 Sep 2026US 12,748,347 B2Carl Zeiss SMT GmbH
- Specimen machining device and specimen machining method18 Nov 2025US 12,476,071 B2JEOL Ltd.
- In-situ etch rate or deposition rate measurement system11 Nov 2025US 12,469,676 B2BüHler Alzenau GmbH
- Endpointing with determination of remaining distance14 Oct 2025US 12,444,569 B2FEI Company
- Specimen machining device and specimen machining method30 Sep 2025US 12,429,333 B2JEOL Ltd.
- Charged Particle Beam Apparatus and Sample Processing Method27 Aug 2026US 2026/0255914 A1Hitachi High-Tech Corporation
- Sample Processing Method and Charged Particle Beam Device23 Jul 2026US 2026/0213125 A1Hitachi High-Tech Corporation
- Automated chemical switching for material delayering9 Apr 2026US 2026/0100328 A1
- Detecting and adjusting lamella deformation11 Dec 2025US 2025/0379028 A1FEI Company
- Editing of deep, multi-layered structures21 Aug 2025US 2025/0266240 A1
Most cited
By later US patents
- Method for making specimen and apparatus thereof77US 5,656,811 AHitachi, Ltd. · 1997
- Focused charged beam apparatus, and its processing and observation method55US 5,525,806 ASeiko Instruments Inc. · 1996
- Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams46US 6,753,253 B1Hitachi, Ltd. · 2004
- Phase shift mask, method of correcting the same and apparatus for carrying out the method42US 5,358,806 AHitachi, Ltd. · 1994
- Wear-through detector for multilayered parts and methods of using same35US 5,947,053 AInternational Business Machines Corporation · 1999