H01J 2237/18
Vacuum control means
H01J2237/18 (Vacuum control means) appears on 557 US grants and 641 published applications in this corpus.
Search patents in H01J- Granted patents
- 557
- Published applications
- 641
- Assignees
- 241
- Inventors
- 1,561
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 9 | 0 |
| 1997 | 5 | 0 |
| 1998 | 10 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 1 |
| 2002 | 12 | 5 |
| 2003 | 7 | 7 |
| 2004 | 12 | 10 |
| 2005 | 5 | 10 |
| 2006 | 9 | 9 |
| 2007 | 9 | 16 |
| 2008 | 6 | 22 |
| 2009 | 12 | 18 |
| 2010 | 6 | 27 |
| 2011 | 14 | 14 |
| 2012 | 18 | 17 |
| 2013 | 20 | 23 |
| 2014 | 30 | 25 |
| 2015 | 23 | 44 |
| 2016 | 29 | 38 |
| 2017 | 31 | 35 |
| 2018 | 27 | 25 |
| 2019 | 25 | 26 |
| 2020 | 32 | 38 |
| 2021 | 22 | 32 |
| 2022 | 26 | 34 |
| 2023 | 23 | 62 |
| 2024 | 23 | 45 |
| 2025 | 39 | 29 |
| 2026 | 32 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Focused ion beam apparatus and control method thereof29 Sep 2026US 12,749,647 B2Samsung Electronics Co., Ltd.
- In-situ back side plasma treatment for residue removal from substrates29 Sep 2026US 12,749,661 B2Lam Research Corporation
- Vacuum processing device15 Sep 2026US 12,738,447 B2Hitachi High-Tech Corporation
- Substrate treatment apparatus and semiconductor device manufacturing method using the same15 Sep 2026US 12,738,464 B2Samsung Electronics Co., Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- Charged particle beam devices and membrane assemblies useful therein8 Oct 2026US 2026/0311957 A1Airsem Technologies Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- High-performance adaptable sampling system1 Oct 2026US 2026/0302145 A1Tokyo Electron Limited
- Plasma processing method and apparatus24 Sep 2026US 2026/0290755 A1Tokyo Electron Limited
- Semiconductor manufacturing facility and method of operating the same17 Sep 2026US 2026/0279744 A1Lot Ces Co., Ltd.
Most cited
By later US patents
- Vacuum trap388US 9,057,388 B2International Business Machines Corporation · 2015
- Electron beam inspection system and method257US 5,502,306 AKLA Instruments Corporation · 1996
- Gas injection system95US 5,435,850 AFEI Company · 1995
- Method for plasma etching tungsten94US 4,838,990 ATexas Instruments Incorporated · 1989
- Charged particle beam lithography machine incorporating localized vacuum envelope75US 4,607,167 AVarian Associates, Inc. · 1986