H01J 2237/182
Obtaining or maintaining desired pressure
H01J2237/182 (Obtaining or maintaining desired pressure) appears on 264 US grants and 330 published applications in this corpus.
Search patents in H01J- Granted patents
- 264
- Published applications
- 330
- Assignees
- 131
- Inventors
- 811
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 2 |
| 2003 | 3 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 4 |
| 2007 | 4 | 8 |
| 2008 | 3 | 9 |
| 2009 | 7 | 8 |
| 2010 | 2 | 13 |
| 2011 | 5 | 6 |
| 2012 | 12 | 4 |
| 2013 | 10 | 12 |
| 2014 | 11 | 13 |
| 2015 | 14 | 28 |
| 2016 | 20 | 26 |
| 2017 | 15 | 16 |
| 2018 | 15 | 17 |
| 2019 | 18 | 13 |
| 2020 | 14 | 17 |
| 2021 | 10 | 15 |
| 2022 | 13 | 16 |
| 2023 | 14 | 37 |
| 2024 | 8 | 34 |
| 2025 | 24 | 13 |
| 2026 | 21 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Focused ion beam apparatus and control method thereof29 Sep 2026US 12,749,647 B2Samsung Electronics Co., Ltd.
- In-situ back side plasma treatment for residue removal from substrates29 Sep 2026US 12,749,661 B2Lam Research Corporation
- Substrate treatment apparatus and semiconductor device manufacturing method using the same15 Sep 2026US 12,738,464 B2Samsung Electronics Co., Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- Methods of selectively etching silicon nitride8 Sep 2026US 12,733,420 B2APPLIED Materials.Inc.
- Charged particle beam devices and membrane assemblies useful therein8 Oct 2026US 2026/0311957 A1Airsem Technologies Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Plasma processing method and apparatus24 Sep 2026US 2026/0290755 A1Tokyo Electron Limited
- Semiconductor manufacturing facility and method of operating the same17 Sep 2026US 2026/0279744 A1Lot Ces Co., Ltd.
- Method for operating a particle beam system, and particle beam system13 Aug 2026US 2026/0237592 A1
Most cited
By later US patents
- Vacuum trap388US 9,057,388 B2International Business Machines Corporation · 2015
- Charged particle beam apparatus55US 7,582,885 B2Hitachi High-Technologies Corporation · 2009
- Process and apparatus for the production of a metal oxide layer49US 5,618,575 ABalzers Aktiengesellschaft · 1997
- Low pressure reactive magnetron sputtering apparatus and method45US 5,525,199 AOptical Corporation of America · 1996
- Getter system for purifying the confinement volume in process chambers39US 6,299,746 B1Saes Getters S. P. A. · 2001