US 5,525,199 A · Low pressure reactive magnetron sputtering apparatus and method

Abstract

A method and apparatus for producing optical films on substrates having extremely high packing densities of the same quality as those films produced by ion beam sputtering including a vacuum chamber with a conventional magnetron sputtering system and unusually high speed vacuum pump means. The low pressure of inert gas created by said high speed vacuum pump means being in the range of 5.times.10.sup.-5 Torr to 1.5.times.10.sup.-4 Torr and the magnetron sputtering system being at least 16" from said substrates. A gas manifold around the magnetron and target material confines the inert working gas in the vicinity of the magnetron and as the gas diffuses and expands into the chamber the high speed vacuum pump means removes the expanded gas from the chamber at a high speed. An ion gun directs ionized reactant gas toward the substrates which has the effect of improving film stoichometry as well as reducing reactant gas at the magnetron. Multiple magnetron assemblies, multiple target materials and compound target materials may be used.

Claims13

Dependent claims

A method of depositing sputtered particles on substrates to form high quality thin film coatings comprising the steps of:

providing a vacuum chamber having magnetron means and source means for sputtered particles,
providing means for positioning substrates in said chamber substantially spaced from but facing said source means to thereby define long throw distances,
impinging said source means with inert gas at an impinging pressure confined to the vicinity of the magnetron means to sputter particles for coating the substrates which also allows some inert gas as well as sputtered particles to enter into the chamber at a pressure lower than said impinging pressure between the source and the substrates,
connecting said chamber to a high speed high vacuum pump
rapidly withdrawing and depleting said inert gas from the chamber by said pump by maintaining the inert gas pressure in said chamber in the range of 5.times.10.sup.-5 Torr to 1.5.times.10.sup.-4 Torr or less, and
directing ionized reactant gas on to said substrates to facilitate reactive coating of said substrates,
whereby low loss optical coatings are obtainable by the exceedingly low pressure in the chamber between said source and substrates and the long throw distances for the sputtered particles to travel to said substrates without inert gas interaction at the substrates.

4 more elements

Dependencies are inferred from the claim text.

Low pressure reactive magnetron sputtering apparatus and method

Life of this patent

Low pressure reactive magnetron sputtering apparatus and method

Life of this patent

Abstract

Claims13