H01J 2237/1825
Evacuating means
H01J2237/1825 (Evacuating means) appears on 124 US grants and 153 published applications in this corpus.
Search patents in H01J- Granted patents
- 124
- Published applications
- 153
- Assignees
- 68
- Inventors
- 358
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 2 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 3 |
| 2007 | 2 | 3 |
| 2008 | 1 | 4 |
| 2009 | 3 | 3 |
| 2010 | 1 | 5 |
| 2011 | 3 | 1 |
| 2012 | 2 | 1 |
| 2013 | 4 | 5 |
| 2014 | 6 | 6 |
| 2015 | 6 | 17 |
| 2016 | 9 | 8 |
| 2017 | 5 | 10 |
| 2018 | 5 | 8 |
| 2019 | 10 | 7 |
| 2020 | 10 | 12 |
| 2021 | 9 | 8 |
| 2022 | 5 | 8 |
| 2023 | 9 | 11 |
| 2024 | 6 | 11 |
| 2025 | 7 | 6 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Focused ion beam apparatus and control method thereof29 Sep 2026US 12,749,647 B2Samsung Electronics Co., Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- System and method of verifying workpiece alignment18 Aug 2026US 12,713,870 B2Axcelis Technologies, Inc.
- Charged particle beam devices and membrane assemblies useful therein7 Jul 2026US 12,676,280 B2Airsem Technologies Ltd.
- Electron gun chamber for scanning electron microscope, electron gun containing same, and scanning electron microscope19 May 2026US 12,633,493 B2National Institute for Materials Science
- Charged particle beam devices and membrane assemblies useful therein8 Oct 2026US 2026/0311957 A1Airsem Technologies Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Plasma processing method and apparatus24 Sep 2026US 2026/0290755 A1Tokyo Electron Limited
- Method for operating a particle beam system, and particle beam system13 Aug 2026US 2026/0237592 A1
- Substrate processing apparatus and substrate processing method30 Jul 2026US 2026/0221391 A1Tokyo Electron Limited
Most cited
By later US patents
- Vacuum trap388US 9,057,388 B2International Business Machines Corporation · 2015
- Charged particle beam apparatus55US 7,582,885 B2Hitachi High-Technologies Corporation · 2009
- Low pressure reactive magnetron sputtering apparatus and method45US 5,525,199 AOptical Corporation of America · 1996
- Very high vacuum magnetron sputtering method and apparatus for precision optical coatings33US 5,656,138 AOptical Corporation of America · 1997
- Low pressure reactive magnetron sputtering apparatus and method30US 5,851,365 ACorning OCA Corporation · 1998