G03F 7/70541
Tagging, i.e. hardware or software tagging of features or components
Official title: {Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers}
G03F7/70541 (Tagging, i.e. hardware or software tagging of features or components) appears on 129 US grants and 97 published applications in this corpus.
Search patents in G03F- Granted patents
- 129
- Published applications
- 97
- Assignees
- 78
- Inventors
- 240
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 2 |
| 2002 | 6 | 10 |
| 2003 | 7 | 5 |
| 2004 | 10 | 8 |
| 2005 | 3 | 5 |
| 2006 | 5 | 9 |
| 2007 | 5 | 3 |
| 2008 | 2 | 6 |
| 2009 | 3 | 5 |
| 2010 | 7 | 2 |
| 2011 | 2 | 2 |
| 2012 | 2 | 5 |
| 2013 | 6 | 1 |
| 2014 | 1 | 2 |
| 2015 | 0 | 1 |
| 2016 | 4 | 2 |
| 2017 | 0 | 1 |
| 2018 | 1 | 6 |
| 2019 | 3 | 2 |
| 2020 | 4 | 6 |
| 2021 | 4 | 3 |
| 2022 | 3 | 6 |
| 2023 | 4 | 2 |
| 2024 | 2 | 0 |
| 2025 | 2 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing an electronic component assembly on the front face of a semi-conductor wafer27 Jan 2026US 12,538,807 B2STMicroelectronics France
- Identification codes on semiconductor chips5 Aug 2025US 12,379,666 B2Infineon Technologies AG
- Tag coordinate determination method and apparatus, computer-readable medium and electronic device21 Jan 2025US 12,204,837 B2Changxin Memory Technologies, Inc.
- Semiconductor process system and method31 Dec 2024US 12,183,607 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for the tracking and identification of components of lithography systems, and lithography system12 Mar 2024US 11,927,888 B2Carl Zeiss SMT GmbH
- Component for a system of semiconductor technology and method for producing a component for a system of semiconductor technology20 Aug 2026US 2026/0244112 A1Carl Zeiss SMT GmbH
- System and method for tracking production workflow information of digital photopolymer printing plates9 Jul 2026US 2026/0194827 A1Esko-Graphics Imaging GmbH
- A Machine-Readable Marker and Identification Method15 May 2025US 2025/0156667 A1Cambridge Enterprise Limited
- Method for producing an electronic component assembly on the front face of a semi-conductor wafer23 Nov 2023US 2023/0378085 A1Exagan
- Identification codes on semiconductor chips2 Nov 2023US 2023/0350309 A1Infineon Technologies AG
Most cited
By later US patents
- Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers604US 5,388,945 AInternational Business Machines Corporation · 1995
- Method of producing a thin layer of semiconductor material453US 6,020,252 ACommissariat A L' Energie Atomique · 2000
- Method of producing a thin layer of semiconductor material323US 6,809,009 B2Commissariat A L' Energie Atomique · 2004
- Method of producing a thin layer of semiconductor material291US 7,067,396 B2Commissariat A L' Energie Atomique · 2006
- Semiconductor device manufacturing method265US 6,703,328 B2Renesas Technology Corp. · 2004