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US 12,379,666 B2Granted
Identification codes on semiconductor chips
AssigneeInfineon Technologies AG
InventorsDetlef Hofmann, Heiko Aßmann
Life of this patent
Estimating the term…
Abstract
A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.
Claims9
A method of generating chip-specific identification code marks on semiconductor chips, the method comprising:
- patterning a resist layer over a semiconductor wafer by laser direct image exposure, wherein the patterning includes writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer and defining a chip pad layout in the resist layer over the chip areas, wherein the resist layer is an uppermost resist layer and remains permanently on the semiconductor wafer;
- and
- developing the patterned resist layer, wherein the chip-specific identification code marks are formed and the chip pads are exposed in the developed resist layer.
Dependencies are inferred from the claim text.