G03F 7/0226
Characterised by the non-macromolecular additives
Official title: {characterised by the non-macromolecular additives}
G03F7/0226 (Characterised by the non-macromolecular additives) appears on 438 US grants and 323 published applications in this corpus.
Search patents in G03F- Granted patents
- 438
- Published applications
- 323
- Assignees
- 136
- Inventors
- 947
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 9 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 16 | 0 |
| 1993 | 19 | 0 |
| 1994 | 27 | 0 |
| 1995 | 18 | 0 |
| 1996 | 11 | 0 |
| 1997 | 8 | 0 |
| 1998 | 18 | 0 |
| 1999 | 9 | 0 |
| 2000 | 8 | 0 |
| 2001 | 13 | 7 |
| 2002 | 17 | 10 |
| 2003 | 6 | 6 |
| 2004 | 6 | 15 |
| 2005 | 7 | 7 |
| 2006 | 7 | 15 |
| 2007 | 6 | 6 |
| 2008 | 7 | 6 |
| 2009 | 5 | 7 |
| 2010 | 4 | 5 |
| 2011 | 2 | 13 |
| 2012 | 6 | 14 |
| 2013 | 8 | 11 |
| 2014 | 15 | 22 |
| 2015 | 11 | 22 |
| 2016 | 22 | 5 |
| 2017 | 10 | 13 |
| 2018 | 9 | 25 |
| 2019 | 10 | 23 |
| 2020 | 11 | 25 |
| 2021 | 14 | 17 |
| 2022 | 13 | 18 |
| 2023 | 16 | 9 |
| 2024 | 7 | 11 |
| 2025 | 6 | 8 |
| 2026 | 5 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Positive photosensitive resin composition for low-temperature process and method for preparing photoresist film19 May 2026US 12,631,965 B2eChem Solutions Corp.
- Positive photosensitive resin composition5 May 2026US 12,619,144 B2Dongjin Semichem Co., Ltd.
- Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component24 Mar 2026US 12,583,973 B2Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element10 Feb 2026US 12,547,074 B2Resonac Corporation
- Functional photoresist and method of patterning nanoparticle thin film using the same6 Jan 2026US 12,517,428 B2Korea University Research and Business Foundation
- Negative photosensitive resin composition, dry film, cured product, and electronic component13 Aug 2026US 2026/0235951 A1Taiyo Holdings Co., Ltd.
- Photosensitive resin composition, resin film having pattern and method for producing same, and semiconductor circuit board16 Jul 2026US 2026/0202742 A1Jsr Corporation
- Photosensitive resin composition, insulating film, and display device comprising same4 Jun 2026US 2026/0153805 A1Dongjin Semichem Co., Ltd.
- Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device21 Aug 2025US 2025/0264801 A1FUJIFILM Corporation
- Compositions and methods of improving metal structure fabrication by wet chemical etch31 Jul 2025US 2025/0244669 A1Merck Patent GmbH
Most cited
By later US patents
- I-line radiation-sensitive alkali-soluble resin composition utilizing 1,2-quinone diazide compound and hydroxy-chalcone additive78US 5,110,706 AJapan Synthetic Rubber Co., Ltd. · 1992
- Positive image forming radiation sensitive compositions containing diazide compound and organic cyclic anhydride74US 4,115,128 AFuji Photo Film Co., Ltd. · 1978
- Method of making a negative photoresist image71US 4,104,070 AInternational Business Machines Corporation · 1978
- Photosensitive members and a process for forming patterns using the same67US 4,356,255 AFuji Photo Film Co., Ltd. · 1982
- Positive-working o-quinone diazide photoresist composition containing a dye and a trihydroxybenzophenone compound60US 4,626,492 AOlin Hunt Specialty Products Inc. · 1986