G03F 7/0212
Characterised by the polymeric binder or the macromolecular additives other than the
Official title: {characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds}
G03F7/0212 (Characterised by the polymeric binder or the macromolecular additives other than the) appears on 145 US grants and 45 published applications in this corpus.
Search patents in G03F- Granted patents
- 145
- Published applications
- 45
- Assignees
- 68
- Inventors
- 285
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 7 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 12 | 0 |
| 1982 | 2 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 10 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 0 |
| 2002 | 1 | 3 |
| 2003 | 4 | 9 |
| 2004 | 4 | 3 |
| 2005 | 4 | 8 |
| 2006 | 2 | 1 |
| 2007 | 3 | 1 |
| 2008 | 1 | 0 |
| 2009 | 1 | 1 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 2 |
| 2019 | 2 | 1 |
| 2020 | 1 | 2 |
| 2021 | 3 | 2 |
| 2022 | 0 | 1 |
| 2023 | 2 | 3 |
| 2024 | 0 | 0 |
| 2025 | 2 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Negative photosensitive resin composition, pattern formation method, and laminated film23 Sep 2025US 12,422,747 B2San-Apro Ltd.
- Resin composition and flow cells incorporating the same29 Apr 2025US 12,287,574 B2Illumina, Inc.
- Enhanced EUV photoresist materials, formulations and processes20 Jun 2023US 11,681,227 B2
- Photoresist composition, its manufacturing method, and manufacturing methods of metal pattern and array substrate28 Feb 2023US 11,592,742 B2Boe Technology Group Co., Ltd.
- Compound, composition, and method for producing same, underlayer film forming material for lithography, composition for underlayer film formation for lithography, and purification method20 Jul 2021US 11,067,889 B2Mitsubishi Gas Chemical Company, Inc.
- Composition for forming thin film and method of manufacturing semiconductor element29 Jan 2026US 2026/0029712 A1Daicel Corporation
- Curable composition, cured film, and display device15 May 2025US 2025/0155803 A1Sumitomo Chemical Company, Limited
- Resist Material And Patterning Process17 Apr 2025US 2025/0123559 A1Shin-Etsu Chemical Co., Ltd.
- Pattern forming method and method for manufacturing electronic device13 Mar 2025US 2025/0085628 A1FUJIFILM Corporation
- Welding method for creating an upscaled master7 Sep 2023US 2023/0280649 A1
Most cited
By later US patents
- Radiation-sensitive recording material for the production of driographic offset printing plates328US 6,274,285 B1Agfa-Gevaert · 2001
- Water-soluble photopolymer and method of forming pattern by use of the same85US 4,745,042 AMatsushita Electric Industrial Co., Ltd. · 1988
- Positive-working radiation-sensitive copying composition and method of using to form relief images84US 4,247,611 AHoechst Aktiengesellschaft · 1981
- Negative working color proofing process comprising diazo compound and polyvinyl acetal/polyvinyl alcohol/polyvinyl acetate resin49US 4,808,508 AHoechst Celanese Corporation · 1989
- Photosensitive composition46US 5,691,101 AKabushiki Kaisha Toshiba · 1997