Back to results
US 4,808,508 AGranted
Negative working color proofing process comprising diazo compound and polyvinyl acetal/polyvinyl alcohol/polyvinyl acetate resin
AssigneeHoechst Celanese Corporation
InventorStephan J. W. Platzer
Life of this patent
Estimating the term…
Abstract
This invention relates to negative photosensitized sheet constructions which, upon exposure to an actinic radiation source through a screened image, can accurately reproduce said image. The construction is useful as a color proofing film which can be employed to predict the image quality from a lithographic printing process.
Claims23
A method for forming a colored image which comprises:
- (A.) providing a photosensitive element which comprises, in order:
- (i) a substrate having a release surface;
- and
- (ii) a photosensitive layer on said release surface, which photosensitive layer comprises a light sensitive, negative working, polymeric diazonium compound;
- a resinous binder composition, which composition contains at least 20% of a resin having the general formula
- --A--B--C--
- wherein a plurality of each of components A, B, and C occur in ordered or random sequence in the resin and wherein A is present in said resin at about 5% to about 20% by weight and comprises groups of he formula ##STR7## B is present in said resin at about 4% to about 30% by weight and comprises groups of the formula ##STR8## and C is present in said resin at about 50% to about 91% by weight and comprises acetal groups consisting of groups of the formulae ##STR9## wherein R is lower alkyl or hydrogen, and wherein said group I. is present in component C from about 75% to about 85%;
- group II. is present in component C from about 3 to about 5%;
- and group III. is present in component C from about 10% to about 22%;
- and at least one colorant;
- and
- (iii) an adhesive layer in direct contact with said photosensitive layer, which adhesive layer comprises a thermoplastic polymer and which adhesive layer is nontacky at room temperature, thermally activated and can be transferred at temperatures between 60.degree. C. and 90.degree. C.;
- and
- (B.) either
- (i) laminating said element with heat and pressure via said adhesive layer to a developer resistant receiver sheet;
- and removing said substrate by the application of peeling forces;
- and imagewise exposing said photosensitive layer to actinic radiation;
- or
- (ii) imagewise exposing said photosensitive layer to actinic radiation;
- and laminating said element with heat and pressure via said adhesive layer to a developer resistant receiver sheet;
- and removing said substrate by the application of peeling forces;
- or
- (iii) laminating said element with heat and pressure via said adhesive layer to a developer resistant receiver sheet;
- and imagewise exposing said photosensitive layer to actinic radiation;
- and removing said substrate by the application of peeling forces;
- and
- (C.) removing the nonexposed areas of said photosensitive layer with a suitable liquid developer, which removing is conducted at a temperature at which said adhesive layer is substantially nontacky.
24 more elements
Dependencies are inferred from the claim text.