G01R 31/2801
Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip
Official title: {Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] (G01R31/318508 takes precedence; contactless testing G01R31/302; testing contacts or connections G01R31/66)}
G01R31/2801 (Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip) appears on 2,014 US grants and 1,693 published applications in this corpus.
Search patents in G01R- Granted patents
- 2,014
- Published applications
- 1,693
- Assignees
- 890
- Inventors
- 4,427
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 10 | 0 |
| 1978 | 7 | 0 |
| 1979 | 8 | 0 |
| 1980 | 8 | 0 |
| 1981 | 4 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 14 | 0 |
| 1985 | 12 | 0 |
| 1986 | 11 | 0 |
| 1987 | 16 | 0 |
| 1988 | 19 | 0 |
| 1989 | 29 | 0 |
| 1990 | 14 | 0 |
| 1991 | 30 | 0 |
| 1992 | 22 | 0 |
| 1993 | 24 | 0 |
| 1994 | 18 | 0 |
| 1995 | 33 | 0 |
| 1996 | 37 | 0 |
| 1997 | 35 | 0 |
| 1998 | 44 | 0 |
| 1999 | 31 | 0 |
| 2000 | 40 | 0 |
| 2001 | 48 | 19 |
| 2002 | 51 | 58 |
| 2003 | 50 | 49 |
| 2004 | 65 | 72 |
| 2005 | 49 | 58 |
| 2006 | 61 | 73 |
| 2007 | 51 | 56 |
| 2008 | 48 | 69 |
| 2009 | 39 | 51 |
| 2010 | 39 | 49 |
| 2011 | 50 | 67 |
| 2012 | 35 | 59 |
| 2013 | 54 | 55 |
| 2014 | 57 | 71 |
| 2015 | 45 | 74 |
| 2016 | 70 | 59 |
| 2017 | 55 | 65 |
| 2018 | 65 | 82 |
| 2019 | 97 | 94 |
| 2020 | 81 | 92 |
| 2021 | 84 | 91 |
| 2022 | 90 | 69 |
| 2023 | 77 | 87 |
| 2024 | 75 | 63 |
| 2025 | 56 | 69 |
| 2026 | 37 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Testing a circuit board6 Oct 2026US 12,754,230 B2Teradyne, Inc.
- Testing system for detecting a fault and a location of the fault6 Oct 2026US 12,754,231 B2KARLZ STORZ Imaging Inc.
- Longitudinally shiftable electrically conductive contact device22 Sep 2026US 12,742,813 B2Feinmetall GmbH
- Solderless high current, high voltage, high bandwidth test fixture22 Sep 2026US 12,742,819 B2Keithley Instruments, LLC
- Low profile electronic testing system with flexible test PCB format25 Aug 2026US 12,716,913 B2Modus Test, LLC
- Programmable compensating probe attachment to neutralize shunt parasitic effects1 Oct 2026US 2026/0299007 A1
- Test board for characterizing dendrite growth in immersion-cooling systems1 Oct 2026US 2026/0299008 A1MTS IP Holdings Ltd
- Method for estimating the level of damage to an element of an assembly, and predictive maintenance method implemented on the basis of such an estimation method24 Sep 2026US 2026/0287641 A1Safran Electronics & Defense
- Memory devices and memory systems outputting codes24 Sep 2026US 2026/0287654 A1SK hynix Inc.
- Diagnostic monitoring and fault detection in vehicle dc power interfaces10 Sep 2026US 2026/0266869 A1Ford Global Technologies, LLC
Most cited
By later US patents
- Electric probing-test machine having a cooling system170US 5,198,752 ATokyo Electron Limited · 1993
- Printed circuit board testing means154US 3,970,934 A1976
- Capacitively-coupled test probe153US 5,274,336 AHewlett-Packard Company · 1993
- Method and apparatus for isolating faults in a logic circuit133US 4,194,113 ANCR Corporation · 1980
- Addressable shadow port and protocol for serial bus networks133US 5,483,518 ATexas Instruments Incorporated · 1996