G01R 31/2818
Using test structures on, or modifications of, the card under test, made
Official title: {using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors (G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266)}
G01R31/2818 (Using test structures on, or modifications of, the card under test, made) appears on 316 US grants and 315 published applications in this corpus.
Search patents in G01R- Granted patents
- 316
- Published applications
- 315
- Assignees
- 224
- Inventors
- 819
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 5 |
| 2002 | 5 | 12 |
| 2003 | 8 | 8 |
| 2004 | 9 | 10 |
| 2005 | 7 | 7 |
| 2006 | 4 | 14 |
| 2007 | 12 | 16 |
| 2008 | 6 | 14 |
| 2009 | 7 | 6 |
| 2010 | 4 | 12 |
| 2011 | 11 | 11 |
| 2012 | 6 | 9 |
| 2013 | 13 | 4 |
| 2014 | 7 | 12 |
| 2015 | 9 | 20 |
| 2016 | 20 | 16 |
| 2017 | 11 | 14 |
| 2018 | 14 | 13 |
| 2019 | 17 | 22 |
| 2020 | 19 | 26 |
| 2021 | 22 | 13 |
| 2022 | 13 | 10 |
| 2023 | 11 | 10 |
| 2024 | 11 | 10 |
| 2025 | 6 | 13 |
| 2026 | 10 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Testing a circuit board6 Oct 2026US 12,754,230 B2Teradyne, Inc.
- Testing system for detecting a fault and a location of the fault6 Oct 2026US 12,754,231 B2KARLZ STORZ Imaging Inc.
- Solderless high current, high voltage, high bandwidth test fixture22 Sep 2026US 12,742,819 B2Keithley Instruments, LLC
- Electronic device including dew condensation sensor18 Aug 2026US 12,710,389 B2LG Electronics Inc.
- Power semiconductor module arrangement and method for producing a power semiconductor module arrangement26 May 2026US 12,642,152 B2Infineon Technologies AG
- Electronic apparatus, print head, and method for manufacturing electronic apparatus10 Sep 2026US 2026/0266893 A1Seiko Epson Corporation
- Test access port expander27 Aug 2026US 2026/0254138 A1Schweitzer Engineering Laboratories, Inc.
- Evaluating the Health Condition of a Single Component Carrier18 Jun 2026US 2026/0169054 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Contact probe for probe head of probe card in apparatus for testing electronic device, probe head, probe card, tested device, and method of manufacturing contact probe26 Feb 2026US 2026/0056235 A1Mpi Corporation
- Circuit board measurement kit and circuit board measurement method12 Feb 2026US 2026/0043842 A1Unimicron Technology Corp.
Most cited
By later US patents
- Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect124US 5,838,161 AMicron Technology, Inc. · 1998
- Methods and test structures for measuring overlay in multilayer devices97US 5,699,282 AThe United States of America as represented by the Secretary of Commerce · 1997
- Method and reference standards for measuring overlay in multilayer structures, and for calibrating imaging equipment as used in semiconductor manufacturing86US 5,617,340 AThe United States of America as represented by the Secretary of Commerce · 1997
- Electrical test structure and method for measuring the relative locations of conductive features on an insulating substrate86US 5,857,258 AThe United States of America as represented by the Secretary of Commerce · 1999
- Method of testing electronic devices indicating short-circuit76US 6,771,077 B2Hitachi, Ltd. · 2004