Electronic apparatus, print head, and method for manufacturing electronic apparatus
AssigneeSeiko Epson Corporation
InventorsHidekazu UEMATSU, Toru MATSUYAMA
Life of this patent
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Abstract
An electronic apparatus includes a circuit substrate. The circuit substrate includes: a signal through-hole through which an electrical signal for driving the electronic apparatus is supplied; a reference through-hole set to a reference electrical potential; and a first inspection through-hole to which a signal is not supplied when the electronic apparatus is used. A distance between the reference through-hole and the first inspection through-hole is shorter than a distance between the reference through-hole and the signal through-hole.
Claims13
An electronic apparatus comprising a circuit substrate, wherein
- the circuit substrate includes
- a signal through-hole through which an electrical signal for driving the electronic apparatus is supplied,
- a reference through-hole set to a reference electrical potential, and
- a first inspection through-hole to which a signal is not supplied when the electronic apparatus is used, and
- a distance between the reference through-hole and the first inspection through-hole is shorter than a distance between the reference through-hole and the signal through-hole.
A print head comprising a circuit substrate, wherein
- the circuit substrate includes
- a signal through-hole through which an electrical signal for driving the print head is supplied,
- a reference through-hole set to a reference electrical potential, and
- a first inspection through-hole to which a signal is not supplied when the print head is used, and
- a distance between the reference through-hole and the first inspection through-hole is shorter than a distance between the reference through-hole and the signal through-hole.
A method for manufacturing an electronic apparatus including a first circuit substrate,
- another electronic apparatus including a second circuit substrate having a same function as the first circuit substrate, the method comprising:
- if conduction between a reference through-hole disposed in the second circuit substrate and set to a reference electrical potential and a first inspection through-hole that is disposed in the second circuit substrate and to which a signal is not supplied when the other electronic apparatus is used is not confirmed, manufacturing the electronic apparatus by using the second circuit substrate as the first circuit substrate;
- and
- if the conduction between the reference through-hole and the first inspection through-hole is confirmed, manufacturing the electronic apparatus without using the second circuit substrate, wherein
- a distance between the reference through-hole and the first inspection through-hole is shorter than a distance between the reference through-hole and a signal through-hole through which an electrical signal for driving the electronic apparatus is supplied.
Dependencies are inferred from the claim text.