G01R 31/275
For testing individual semiconductor components within integrated circuits
Official title: {for testing individual semiconductor components within integrated circuits}
G01R31/275 (For testing individual semiconductor components within integrated circuits) appears on 218 US grants and 191 published applications in this corpus.
Search patents in G01R- Granted patents
- 218
- Published applications
- 191
- Assignees
- 124
- Inventors
- 428
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 9 | 1 |
| 2002 | 8 | 5 |
| 2003 | 4 | 10 |
| 2004 | 8 | 7 |
| 2005 | 8 | 9 |
| 2006 | 9 | 7 |
| 2007 | 8 | 11 |
| 2008 | 10 | 12 |
| 2009 | 9 | 5 |
| 2010 | 4 | 5 |
| 2011 | 9 | 6 |
| 2012 | 4 | 3 |
| 2013 | 3 | 10 |
| 2014 | 6 | 7 |
| 2015 | 7 | 3 |
| 2016 | 8 | 3 |
| 2017 | 2 | 5 |
| 2018 | 3 | 6 |
| 2019 | 11 | 13 |
| 2020 | 8 | 11 |
| 2021 | 11 | 9 |
| 2022 | 8 | 12 |
| 2023 | 9 | 9 |
| 2024 | 13 | 6 |
| 2025 | 6 | 10 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Testing module and testing method using the same11 Aug 2026US 12,704,541 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laser-induced hot carrier injection (HCI) for accelerated aging of integrated circuits11 Aug 2026US 12,704,545 B2Intel Corporation
- Evaluation circuit, semiconductor device, and evaluation method7 Jul 2026US 12,674,832 B2Winbond Electronics Corp.
- Pulsed laser micro LED inspection3 Mar 2026US 12,566,208 B2Orbotech Ltd.
- Circuitry for electrical redundancy in bonded structures30 Sep 2025US 12,431,449 B2Adeia Semiconductor Bonding Technologies Inc.
- Evaluation and performance analysis of discrete fets in parallel configurations for power applications1 Oct 2026US 2026/0299006 A1
- Pattern testing method, device, apparatus and medium for single die10 Sep 2026US 2026/0266891 A1Shenzhen Rayson Technology Co., Ltd.
- Semiconductor device27 Aug 2026US 2026/0251692 A1Infineon Technologies Austria AG
- Capacitor leak detect and retire27 Aug 2026US 2026/0251693 A1Micron Technology, Inc.
- Capacitor detection structure and capacitor detection method6 Aug 2026US 2026/0231448 A1Winbond Electronics Corp.
Most cited
By later US patents
- Compositions and methods for helper-free production of recombinant adeno-associated viruses184US 6,258,595 B1The Trustees of the University of Pennsylvania · 2001
- Compositions and methods for helper-free production of recombinant adeno-associated viruses144US 6,485,966 B2The Trustees of the University of Pennsylvania · 2002
- Compositions and methods for helper-free production of recombinant adeno-associated viruses144US 7,022,519 B2The Trustees of the University of Pennsylvania · 2006
- Method for making die-compensated threshold tuning circuit90US 6,048,746 ASun Microsystems, Inc. · 2000
- Method for testing semiconductor devices78US 6,512,392 B2International Business Machines Corporation · 2003