G01R 31/27
Testing of devices without physical removal from the circuit of which they
Official title: Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements {(testing printed circuit boards G01R31/2801)}
G01R31/27 (Testing of devices without physical removal from the circuit of which they) appears on 407 US grants and 392 published applications in this corpus.
Search patents in G01R- Granted patents
- 407
- Published applications
- 392
- Assignees
- 214
- Inventors
- 839
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 7 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 13 | 2 |
| 2002 | 13 | 11 |
| 2003 | 6 | 13 |
| 2004 | 14 | 9 |
| 2005 | 15 | 15 |
| 2006 | 15 | 12 |
| 2007 | 10 | 13 |
| 2008 | 14 | 13 |
| 2009 | 11 | 7 |
| 2010 | 6 | 7 |
| 2011 | 10 | 9 |
| 2012 | 5 | 4 |
| 2013 | 6 | 15 |
| 2014 | 9 | 12 |
| 2015 | 12 | 9 |
| 2016 | 12 | 5 |
| 2017 | 10 | 18 |
| 2018 | 9 | 11 |
| 2019 | 18 | 20 |
| 2020 | 15 | 25 |
| 2021 | 23 | 21 |
| 2022 | 13 | 21 |
| 2023 | 19 | 21 |
| 2024 | 25 | 56 |
| 2025 | 42 | 23 |
| 2026 | 23 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Diagnosis and prognosis of IGBT modules15 Sep 2026US 12,736,578 B2ABB Schweiz AG
- GaN reliability built-in self test (BIST) apparatus and method for qualifying dynamic on-state resistance degradation1 Sep 2026US 12,724,061 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Testing module and testing method using the same11 Aug 2026US 12,704,541 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laser-induced hot carrier injection (HCI) for accelerated aging of integrated circuits11 Aug 2026US 12,704,545 B2Intel Corporation
- Evaluation circuit, semiconductor device, and evaluation method7 Jul 2026US 12,674,832 B2Winbond Electronics Corp.
- Evaluation and performance analysis of discrete fets in parallel configurations for power applications1 Oct 2026US 2026/0299006 A1
- Pattern testing method, device, apparatus and medium for single die10 Sep 2026US 2026/0266891 A1Shenzhen Rayson Technology Co., Ltd.
- Semiconductor device27 Aug 2026US 2026/0251692 A1Infineon Technologies Austria AG
- Capacitor leak detect and retire27 Aug 2026US 2026/0251693 A1Micron Technology, Inc.
- Determining an Aging State of a Contacting Layer of a Semiconductor Component and Semiconductor Assembly20 Aug 2026US 2026/0243730 A1Siemens Aktiengesellschaft
Most cited
By later US patents
- Compositions and methods for helper-free production of recombinant adeno-associated viruses184US 6,258,595 B1The Trustees of the University of Pennsylvania · 2001
- Compositions and methods for helper-free production of recombinant adeno-associated viruses144US 6,485,966 B2The Trustees of the University of Pennsylvania · 2002
- Compositions and methods for helper-free production of recombinant adeno-associated viruses144US 7,022,519 B2The Trustees of the University of Pennsylvania · 2006
- System and method for measuring transistor leakage current with a ring oscillator116US 6,882,172 B1Transmeta Corporation · 2005
- Method for making die-compensated threshold tuning circuit90US 6,048,746 ASun Microsystems, Inc. · 2000