Pattern testing method, device, apparatus and medium for single die

A pattern testing method for a single die, comprising:

• S110:
• determining a first die to be tested from a wafer to be tested, and determining a first capacity to be tested for the single first die;
• S120:
• obtaining a current first parameter-passing file when the first capacity to be tested is greater than a preset capacity threshold;
• wherein the first parameter-passing file comprises:
• first algorithm selection information and a preset difference;
• the first algorithm selection information is binary data with all zeros, and a number of bits of the binary data is the same as a current first total number of candidate pattern testing algorithms;
• S130:
• updating the first algorithm selection information based on, a first capacity difference between the first capacity to be tested and the preset capacity threshold, and the preset difference to obtain second algorithm selection information and an updated second parameter-passing file comprising the second algorithm selection information;
• S140:
• running and parsing the second parameter-passing file, and determining and starting a target pattern testing algorithm from multiple different candidate pattern testing algorithms according to the second algorithm selection information;
• S150:
• performing pattern testing on the first die to be tested zone-by-zone based on the second parameter-passing file and the target pattern testing algorithm to complete single-die testing.