US 12,431,449 B2 · Circuitry for electrical redundancy in bonded structures

Abstract

A bonded structure is disclosed. The bonded structure can include a first element that has a first plurality of contact pads. The first plurality of contact pads includes a first contact pad and a second redundant contact pad. The bonded structure can also include a second element directly bonded to the first element without an intervening adhesive. The second element has a second plurality of contact pads. The second plurality of contact pads includes a third contact pad and a fourth redundant contact pad. The first contact pad is configured to connect to the third contact pad. The second contact pad is configured to connect to the fourth contact pad. The bonded structure can include circuitry that has a first state in which an electrical signal is transferred to the first contact pad and a second state in which the electrical signal is transferred to the second contact pad.

Claims23

Dependent claims

A bonded structure comprising:

a first element having a first plurality of contact pads at a first surface, the first plurality of contact pads including a first contact pad and a second contact pad spaced apart from one another along the first surface;
a second element hybrid bonded to the first element without an intervening adhesive, the second element having a second plurality of contact pads at a second surface, the second plurality of contact pads including a third contact pad and a fourth contact pad spaced apart from one another along the second surface, wherein the first contact pad is disposed opposite to the third contact pad, and wherein the second contact pad is disposed opposite to the fourth contact pad;
and
switching circuitry for selectively transferring an electrical signal either through the first and third contact pads or through the second and fourth contact pads, thereby providing redundant connections between the first and second elements.

1 more element

Dependencies are inferred from the claim text.

Circuitry for electrical redundancy in bonded structures

Life of this patent

Circuitry for electrical redundancy in bonded structures

Life of this patent

Abstract

Claims23