G01R 1/07342
The body of the probe being at an angle other than perpendicular
Official title: {the body of the probe being at an angle other than perpendicular to test object, e.g. probe card}
G01R1/07342 (The body of the probe being at an angle other than perpendicular) appears on 1,063 US grants and 1,134 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,063
- Published applications
- 1,134
- Assignees
- 376
- Inventors
- 2,006
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 3 | 0 |
| 1988 | 10 | 0 |
| 1989 | 8 | 0 |
| 1990 | 10 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 3 | 0 |
| 1994 | 9 | 0 |
| 1995 | 3 | 0 |
| 1996 | 11 | 0 |
| 1997 | 14 | 0 |
| 1998 | 21 | 0 |
| 1999 | 24 | 0 |
| 2000 | 24 | 0 |
| 2001 | 26 | 13 |
| 2002 | 28 | 37 |
| 2003 | 26 | 34 |
| 2004 | 28 | 38 |
| 2005 | 40 | 48 |
| 2006 | 44 | 48 |
| 2007 | 27 | 64 |
| 2008 | 34 | 86 |
| 2009 | 57 | 49 |
| 2010 | 47 | 42 |
| 2011 | 35 | 19 |
| 2012 | 23 | 20 |
| 2013 | 11 | 21 |
| 2014 | 16 | 25 |
| 2015 | 22 | 28 |
| 2016 | 30 | 19 |
| 2017 | 24 | 24 |
| 2018 | 16 | 26 |
| 2019 | 25 | 46 |
| 2020 | 41 | 62 |
| 2021 | 57 | 63 |
| 2022 | 46 | 52 |
| 2023 | 38 | 60 |
| 2024 | 56 | 65 |
| 2025 | 49 | 73 |
| 2026 | 42 | 72 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical connecting device and method for manufacturing electrical connecting device29 Sep 2026US 12,748,130 B2Kabushiki Kaisha Nihon Micronics
- Testing system, battery production line, and testing method22 Sep 2026US 12,742,796 B2Contemporary Amperex Technology Co., Limited
- System and method for automatic probe card replacement22 Sep 2026US 12,742,797 B1InZiv Ltd.
- Solderless high current, high voltage, high bandwidth test fixture22 Sep 2026US 12,742,819 B2Keithley Instruments, LLC
- Electrically conductive contact pin and manufacturing method therefor15 Sep 2026US 12,736,560 B2Point Engineering Co., Ltd.
- Conductive probing interface device8 Oct 2026US 2026/0309775 A1International Business Machines Corporation
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Composite interface substrate for a probe card and methods for forming and operating the same1 Oct 2026US 2026/0299017 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Parametric testing system24 Sep 2026US 2026/0287617 A1Chroma Ate Inc.
- Wiring board and probe card24 Sep 2026US 2026/0292982 A1KYOCERA Corporation
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Contact carriers (tiles) for populating larger substrates with spring contacts304US 5,806,181 AFormFactor, Inc. · 1998
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Wafer-level burn-in and test278US 6,064,213 AFormFactor, Inc. · 2000