Wiring board and probe card

A wiring board comprising:

• an insulating substrate comprising a first surface, a second surface located opposite to the first surface, and multiple wiring layers;
• multiple first electrodes located on the first surface;
• multiple second electrodes located on the second surface;
• and
• multiple wiring conductors extending between respective ones of the multiple first electrodes and corresponding ones of the multiple second electrodes, wherein
• the multiple wiring conductors comprise:
• respective ones of film conductors each located at any of the multiple wiring layers;
• respective ones of first via conductors extending between the respective ones of the film conductors and corresponding ones of the multiple first electrodes;
• and
• respective ones of second via conductors extending between the respective ones of the film conductors and corresponding ones of the multiple second electrodes,
• the insulating substrate comprises a center region and an outer peripheral region, wherein when a line segment connecting a center and an outer periphery of the insulating substrate in transparent plan view is drawn, the center region covers a range of two-thirds of the line segment closer to the center in any direction, and the outer peripheral region covers a range of one-thirds of the line segment closer to the outer periphery in any direction,
• the multiple first electrodes are located in the center region,
• at least some of the multiple second electrodes are located in the outer peripheral region, and
• among the second via conductors located in the outer peripheral region, a number of the second via conductors with a portion located within half a thickness of the insulating substrate from the first surface is larger than a number of the second via conductors not located within half the thickness of the insulating substrate from the first surface.