C23C 18/1862
By radiant energy
Official title: {by radiant energy}
C23C18/1862 (By radiant energy) appears on 124 US grants and 120 published applications in this corpus.
Search patents in C23C- Granted patents
- 124
- Published applications
- 120
- Assignees
- 106
- Inventors
- 424
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 9 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 3 |
| 2003 | 2 | 2 |
| 2004 | 1 | 6 |
| 2005 | 1 | 14 |
| 2006 | 4 | 7 |
| 2007 | 2 | 7 |
| 2008 | 3 | 3 |
| 2009 | 6 | 3 |
| 2010 | 2 | 0 |
| 2011 | 1 | 6 |
| 2012 | 1 | 1 |
| 2013 | 1 | 2 |
| 2014 | 3 | 10 |
| 2015 | 5 | 10 |
| 2016 | 4 | 17 |
| 2017 | 8 | 7 |
| 2018 | 10 | 3 |
| 2019 | 3 | 9 |
| 2020 | 2 | 3 |
| 2021 | 3 | 0 |
| 2022 | 2 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 3 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a mold for injection molding6 Jan 2026US 12,515,379 B2Hella GmbH & Co. KGaA
- Method for selective metallisation of inorganic dielectrics or semiconductors17 Jun 2025US 12,336,114 B2Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Method for manufacturing electrically conductive structures on a carrier material8 Aug 2023US 11,718,727 B2Chemische Fabrik Budenheim KG
- Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer24 Jan 2023US 11,561,631 B2FUJIFILM Corporation
- Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device20 Sep 2022US 11,447,871 B2Mitsubishi Electric Corporation
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Catalyst for water electrolysis using fluorine-doped tin oxide support and method for manufacturing the same30 Oct 2025US 2025/0333846 A1Korea Basic Science Institute
- Method for selective metallisation of inorganic dielectrics or semiconductors5 Dec 2024US 2024/0407107 A1Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Production method for plated substrate5 Sep 2024US 2024/0295028 A1National University Corporation, Iwate University
- Glass coating to minimize roughness inside through glass vias6 Jun 2024US 2024/0188225 A1Intel Corporation
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Selective deposition of copper95US 4,574,095 AInternational Business Machines Corporation · 1986
- Activation of refractory metal surfaces for electroless plating64US 4,746,375 AGeneral Electric Company · 1988
- Metallized ceramic substrate and method therefor42US 5,058,799 A1991
- Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate41US 4,478,883 AInternational Business Machines Corporation · 1984