Production method for plated substrate

A production method for a plated substrate, comprising:

• a bonding agent provision step for providing a photoreactive bonding agent on a surface of a substrate made of glass or silicon;
• an irradiation step for irradiating the surface of the substrate with light to allow the surface of the substrate and the photoreactive bonding agent to be bonded to each other, the photoreactive bonding agent being provided on the surface of the substrate;
• a first washing step for, after the irradiation step, removing by washing the photoreactive bonding agent that is not bonded to the surface of the substrate;
• a catalyst provision step for, after the first washing step, providing a catalyst that binds to the photoreactive bonding agent;
• a second washing step for, after the catalyst provision step, removing by washing the catalyst that does not bind to the photoreactive bonding agent;
• and
• a plating step for disposing a conductive substance on the photoreactive bonding agent by an electroless plating process after the second washing step, the catalyst binding to the photoreactive bonding agent.