Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device

An apparatus for manufacturing a semiconductor device, comprising:

• a reaction bath for immersing a semiconductor wafer in a reaction solution stored therein to form a plating film on the semiconductor wafer;
• at least one supply pipe provided inside the reaction bath and including a plurality of ejection holes for ejecting the reaction solution, the ejecting holes being arranged in a longitudinal direction of the supply pipe;
• a first reservoir bath provided adjacent to the reaction bath and storing therein the reaction solution overflowed from the reaction bath, wherein the supply pipe extends away from the first reservoir bath;
• a second reservoir bath different from the first reservoir bath, wherein:
• the first reservoir bath is provided on a first end side of the supply pipe;
• the second reservoir bath is provided on a second end side of the supply pipe;
• and
• a pipe that connects the first reservoir bath and the reaction bath to allow transport of the reaction solution from the first reservoir bath to the reaction bath, the pipe being in direct contact with a longitudinal mid-portion of the supply pipe in the reaction bath,
• wherein in a portion of the supply pipe that includes the ejection holes, the aperture ratio of the ejection holes in a volume of the pipe more distant from the first reservoir bath and the second reservoir bath is higher than that of the ejection holes in a same size volume of the pipe closer to the first reservoir bath and the second reservoir bath.