Back to results
US 4,478,883 AGranted
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
AssigneeInternational Business Machines Corporation
InventorsJames R. Bupp, Voya Markovich, Tracy E. Napp, Carlos J. Sambucetti
Life of this patent
Estimating the term…
Abstract
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate.
Claims27
A method for conditioning at least one surface of a dielectric substrate material for the electroless plating of a conductive metal thereon, which comprises:
- contacting said at least one surface with a composition containing a multifunctional ionic polymer material containing at least two available ionic moieties, wherein said ionic moieties are of a charge opposite from the charge associated with the colloidal catalyst particles to be subsequently applied to the substrate to provide for electrostatic attraction of said colloidal catalyst particles, and then activating the surface by contacting it with a composition containing a colloidal catalyst to provide directly or as a precursor leading to catalytic sites capable of electroless plating initiation of a conductive metal thereon.
Dependencies are inferred from the claim text.