C23C 18/1868
Radiation
Official title: {Radiation, e.g. UV, laser}
C23C18/1868 (Radiation) appears on 57 US grants and 78 published applications in this corpus.
Search patents in C23C- Granted patents
- 57
- Published applications
- 78
- Assignees
- 67
- Inventors
- 266
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 3 |
| 2005 | 1 | 7 |
| 2006 | 1 | 3 |
| 2007 | 2 | 6 |
| 2008 | 1 | 2 |
| 2009 | 3 | 1 |
| 2010 | 1 | 0 |
| 2011 | 1 | 4 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 3 | 8 |
| 2015 | 5 | 9 |
| 2016 | 3 | 11 |
| 2017 | 5 | 4 |
| 2018 | 5 | 2 |
| 2019 | 2 | 7 |
| 2020 | 1 | 3 |
| 2021 | 2 | 0 |
| 2022 | 1 | 1 |
| 2023 | 2 | 0 |
| 2024 | 0 | 3 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a mold for injection molding6 Jan 2026US 12,515,379 B2Hella GmbH & Co. KGaA
- Method for selective metallisation of inorganic dielectrics or semiconductors17 Jun 2025US 12,336,114 B2Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Method for manufacturing electrically conductive structures on a carrier material8 Aug 2023US 11,718,727 B2Chemische Fabrik Budenheim KG
- Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer24 Jan 2023US 11,561,631 B2FUJIFILM Corporation
- Electronic-component manufacturing method and electronic components1 Mar 2022US 11,266,025 B2Qualtec Co., Ltd.
- Catalyst for water electrolysis using fluorine-doped tin oxide support and method for manufacturing the same30 Oct 2025US 2025/0333846 A1Korea Basic Science Institute
- Method for selective metallisation of inorganic dielectrics or semiconductors5 Dec 2024US 2024/0407107 A1Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Production method for plated substrate5 Sep 2024US 2024/0295028 A1National University Corporation, Iwate University
- Glass coating to minimize roughness inside through glass vias6 Jun 2024US 2024/0188225 A1Intel Corporation
- Method of manufacturing a mold for injection molding1 Dec 2022US 2022/0379535 A1Hella GmbH & Co. KGaA
Most cited
By later US patents
- Selective deposition of copper95US 4,574,095 AInternational Business Machines Corporation · 1986
- Electroless plating process and process for producing multilayer wiring board38US 4,659,587 AHitachi, Ltd. · 1987
- Method for applying metal catalyst patterns onto ceramic for electroless copper deposition36US 5,139,818 AGeneral Motors Corporation · 1992
- Surface graft material, conductive pattern material, and production method thereof31US 7,291,427 B2FUJIFILM Corporation · 2007
- Efficient chemistry for selective modification and metallization of substrates28US 5,648,201 AThe United Sates of America as represented by the Secretary of the Navy · 1997