Electronic-component manufacturing method and electronic components

A method of manufacturing an electronic component in which interconnects are formed on a front surface of a substrate, the electronic-component manufacturing method comprising:

• a first step of shining either a picosecond laser beam in which the pulse-width units are picoseconds, or a femtosecond laser beam in which they are femtoseconds, on the front surface of the substrate to form an interconnect pattern, applying a catalyst on the front surface of the interconnect pattern on the substrate and thereafter immersing the substrate in a hydrochloric acid solution, forming a electroless copper metallization layer on the front surface of the substrate, and forming a mask onto the electroless copper metallization layer on the front surface of the substrate;
• a second step of shining the laser beam superficially on the mask where it corresponds to the interconnect pattern to perforate the mask and form patterned interconnects on the substrate;
• a third step of forming on the patterned interconnects a electroplated copper metallization layer in a configuration of squares;
• a fourth step of exfoliating the mask;
• and
• a fifth step of removing the electroless copper metallization layer where it has been exposed by the exfoliating of the mask;
• wherein
• the substrate is of a material being any of an acrylic resin, PET, PTFE, glass, an epoxy resin, a liquid-crystal polymer, or a polyimide resin;
• and
• the catalyst is an Sn—Pd catalyst.