C23C 18/1865
Heat
Official title: {Heat}
C23C18/1865 (Heat) appears on 72 US grants and 49 published applications in this corpus.
Search patents in C23C- Granted patents
- 72
- Published applications
- 49
- Assignees
- 62
- Inventors
- 211
- Latest grant
- 24 Jan 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 3 |
| 2003 | 2 | 2 |
| 2004 | 0 | 3 |
| 2005 | 0 | 7 |
| 2006 | 3 | 4 |
| 2007 | 0 | 2 |
| 2008 | 2 | 2 |
| 2009 | 3 | 3 |
| 2010 | 1 | 0 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 5 |
| 2015 | 1 | 2 |
| 2016 | 2 | 2 |
| 2017 | 2 | 2 |
| 2018 | 3 | 2 |
| 2019 | 1 | 4 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer24 Jan 2023US 11,561,631 B2FUJIFILM Corporation
- Plating method, plating apparatus and recording medium8 Jun 2021US 11,028,483 B2Tokyo Electron Limited
- Optical printing systems and methods5 May 2020US 10,640,873 B2Board of Regents, The University of Texas System
- Laminate structure of metal coating28 May 2019US 10,306,774 B2Electroplating Engineers of Japan Limited
- Patterning of electroless metals by selective deactivation of catalysts24 Jul 2018US 10,034,386 B2Averatek Corporation
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- System and method for direct electroless plating of 3d-printable glass for selective surface patterning30 Mar 2023US 2023/0095982 A1Lawrence Livermore National Security, LLC
- Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer31 Dec 2020US 2020/0409488 A1FUJIFILM Corporation
- Optical printing systems and methods29 Aug 2019US 2019/0264327 A1Board of Regents, The University of Texas System
- Plating method, plating apparatus and recording medium22 Aug 2019US 2019/0256980 A1Tokyo Electron Limited
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Activation of refractory metal surfaces for electroless plating64US 4,746,375 AGeneral Electric Company · 1988
- Metallized ceramic substrate and method therefor42US 5,058,799 A1991
- Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate41US 4,478,883 AInternational Business Machines Corporation · 1984
- Seeding process for electroless metal deposition40US 4,701,351 AInternational Business Machines Corporation · 1987