Plating method, plating apparatus and recording medium
AssigneeTokyo Electron Limited
InventorsYuichiro Inatomi, Takashi Tanaka, Kazutoshi Iwai
Life of this patent
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Abstract
A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by performing a plating processing on the substrate W. Before the imparting of the catalyst, an organic film 36 is formed on the substrate W by supplying an organic liquid L1 onto the substrate W.
Claims5
A plating method, comprising:
- preparing a substrate having, on a surface thereof, a non-plateable material portion to which a catalyst is not substantially adsorbed and a plateable material portion to which the catalyst is adsorbed and made of a different material from the non-plateable material portion, the non-plateable material portion and the plateable material portion being exposed to the surface of the substrate;
- imparting a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate;
- and
- forming a plating layer selectively on the plateable material portion by performing a plating processing on the substrate,
- wherein, before the imparting of the catalyst, forming an organic film is performed on the non-plateable material portion and the plateable material portion of the substrate by supplying an organic liquid, which suppresses the catalyst from adhering to the non-plateable material portion, onto the substrate, and
- the organic film has a thickness that does not suppress the catalyst from adhering to the plateable material portion.
Dependencies are inferred from the claim text.