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US 4,701,351 AGranted
Seeding process for electroless metal deposition
AssigneeInternational Business Machines Corporation
InventorRobert L. Jackson
Life of this patent
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Abstract
A process for depositing and tightly binding noble metal seeds onto a substrate by coating the substrate with a very thin layer of a polymer which complexes with a noble metal compound and contacting the layer of polymer with a noble metal compound which forms a complex with the layer of polymer.
Claims9
A process for depositing and tightly binding noble metal seeds onto a substrate, said process being characterized by the steps of:
- (1) coating the substrate with a thin layer less than 1 micron thick of a polyamine, polyacid or salt of a polyacid polymer which complexes with a noble metal compound, and
- (2) contacting said layer of polymer with a noble metal compound which forms a complex with the layer of polymer.
A process for depositing and tightly binding noble metal seeds in a pattern onto a substrate, said process being characterized by the steps of:
- (1) coating the substrate with a thin layer less than 1 micron thick of a polyamine, polyacid or salt of a polyacid polymer which complexes with a noble metal compound,
- (2) overcoating said thin polymer layer with a photoresist,
- (3) patternwise exposing and developing the photoresist to define the pattern to be metallized, and
- (4) coating the substrate with a noble metal compound which selectively forms a complex with the thin polymer layer and not with the photoresist.
1 more element
Dependencies are inferred from the claim text.