C23C 18/1651
Two or more layers only obtained by electroless plating
Official title: {Two or more layers only obtained by electroless plating}
C23C18/1651 (Two or more layers only obtained by electroless plating) appears on 462 US grants and 662 published applications in this corpus.
Search patents in C23C- Granted patents
- 462
- Published applications
- 662
- Assignees
- 371
- Inventors
- 1,470
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 4 |
| 2002 | 8 | 9 |
| 2003 | 13 | 21 |
| 2004 | 14 | 24 |
| 2005 | 7 | 32 |
| 2006 | 8 | 33 |
| 2007 | 10 | 39 |
| 2008 | 9 | 23 |
| 2009 | 17 | 24 |
| 2010 | 16 | 27 |
| 2011 | 18 | 30 |
| 2012 | 11 | 36 |
| 2013 | 18 | 30 |
| 2014 | 21 | 44 |
| 2015 | 18 | 46 |
| 2016 | 28 | 51 |
| 2017 | 30 | 16 |
| 2018 | 24 | 27 |
| 2019 | 25 | 24 |
| 2020 | 24 | 30 |
| 2021 | 23 | 16 |
| 2022 | 12 | 28 |
| 2023 | 8 | 18 |
| 2024 | 15 | 8 |
| 2025 | 12 | 18 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electroless deposition process for semiconductor devices6 Oct 2026US 12,757,651 B2
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Bendable nickel plating on flexible substrates17 Feb 2026US 12,553,134 B2MacDermid Enthone Inc.
- Electronic device including outer housing plated with conductive member and manufacturing method therefor3 Feb 2026US 12,540,402 B2Intops Co., Ltd.
- Plating stack16 Dec 2025US 12,497,699 B2Japan Pure Chemical Co., Ltd.
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Manufacturing method of rolled surface-treated steel sheet and rolled surface-treated steel sheet2 Jul 2026US 2026/0185235 A1Toyo Kohan Co.Ltd
- Bendable Nickel Plating on Flexible Substrates21 May 2026US 2026/0139380 A1
- Liquid-cooling cooler having nickel multilayer structure9 Apr 2026US 2026/0098343 A1Amulaire Thermal Technology, Inc.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Copper metallization of USLI by electroless process269US 6,180,523 B2Industrial Technology Research Institute · 2001
- Method for forming Co-W-P-Au films259US 6,323,128 B1International Business Machines Corporation · 2001