Liquid-cooling cooler having nickel multilayer structure

Abstract

A liquid-cooling cooler having a nickel multilayer structure includes a liquid-cooling cooler body and the nickel multilayer structure. The nickel multilayer structure is formed on the liquid-cooling cooler body for bonding with at least one heat source. A topmost layer of the nickel multilayer structure is a pure nickel electroplating layer, and a nickel content of the pure nickel electroplating layer is greater than 99 wt %. An electroless nickel-phosphorus plating layer is disposed beneath the pure nickel electroplating layer, and a phosphorus content of the electroless nickel-phosphorus plating layer ranges between 6 wt % and 13 wt %. The liquid-cooling cooler body is made of a non-nickel metal. A thickness of the pure nickel electroplating layer is less than or equal to 2 μm, and a thickness of the electroless nickel-phosphorus plating layer ranges between 3 μm and 12 μm.

Dependencies are inferred from the claim text.