Plating stack
AssigneeJapan Pure Chemical Co., Ltd.
InventorsKenji Yoshiba, Yusuke Yaguchi, Hiroshi Minowa
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Abstract
In the method for producing a plating stack, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of a third metal is deposited on the plating layer A, and then a plating layer C mainly composed of the second metal, the third metal, or a fourth metal is deposited on the plating layer B by a redox reaction. A concrete configuration of plating layers includes, for example, the plating layer A is gold, platinum or silver, the plating layer B is palladium, and the plating layer C is palladium.
Claims4
A method for producing a plating stack in which a plating layer A mainly composed of gold, platinum or silver is deposited on an object to be plated mainly composed of copper, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of palladium is deposited on the plating layer B,
- wherein the plating layer B is a substitution plating layer formed by a substitution reaction between a palladium ion contained in a substitution plating solution, and copper contained in the object to be plated or gold, platinum or silver contained in the plating layer A,
- wherein the plating layer C is a reduction plating layer, formed by a redox reaction between a reducing agent and a palladium ion contained in a reduction plating solution.
Dependencies are inferred from the claim text.