C23C 18/165
Multilayered product
Official title: {Multilayered product (layered product B32B)}
C23C18/165 (Multilayered product) appears on 1,153 US grants and 1,746 published applications in this corpus.
Search patents in C23C- Granted patents
- 1,153
- Published applications
- 1,746
- Assignees
- 793
- Inventors
- 3,599
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 9 | 0 |
| 1987 | 7 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 9 | 0 |
| 1997 | 9 | 0 |
| 1998 | 5 | 0 |
| 1999 | 11 | 0 |
| 2000 | 11 | 0 |
| 2001 | 17 | 8 |
| 2002 | 21 | 22 |
| 2003 | 24 | 42 |
| 2004 | 26 | 46 |
| 2005 | 17 | 68 |
| 2006 | 23 | 64 |
| 2007 | 25 | 75 |
| 2008 | 14 | 56 |
| 2009 | 26 | 65 |
| 2010 | 36 | 81 |
| 2011 | 36 | 64 |
| 2012 | 41 | 72 |
| 2013 | 32 | 60 |
| 2014 | 44 | 92 |
| 2015 | 48 | 107 |
| 2016 | 61 | 151 |
| 2017 | 66 | 82 |
| 2018 | 68 | 87 |
| 2019 | 77 | 84 |
| 2020 | 65 | 97 |
| 2021 | 61 | 62 |
| 2022 | 53 | 58 |
| 2023 | 39 | 75 |
| 2024 | 45 | 60 |
| 2025 | 36 | 43 |
| 2026 | 17 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electroless deposition process for semiconductor devices6 Oct 2026US 12,757,651 B2
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Integrated atmospheric plasma treatment station in processing tool2 Jun 2026US 12,648,418 B2Lam Research Corporation
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Vacuum-integrated hardmask processes and apparatus389US 9,778,561 B2Lam Research Corporation · 2017
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997