US 12,648,418 B2 · Integrated atmospheric plasma treatment station in processing tool

Abstract

An atmospheric plasma treatment station is integrated in a semiconductor process tool. The atmospheric plasma treatment station directly interfaces with a deposition chamber of the semiconductor process tool without adding to the footprint or form factor of the semiconductor process tool. The atmospheric plasma treatment station includes a movable atmospheric plasma source such as a linear head for scanning across a surface of a substrate. The atmospheric plasma treatment station provides an enclosed space in a controlled environment with non-reactive gas flowing through the enclosed space. Process gases may be supplied to the linear head based on a surface condition of the substrate being treated.

Claims20

Dependent claims

An apparatus for processing semiconductor substrates, the apparatus comprising:

one or more cassettes for receiving a semiconductor substrate;
a deposition chamber for depositing materials on the semiconductor substrate;
and
an atmospheric plasma treatment station for exposing the semiconductor substrate to an atmospheric plasma prior to deposition in the deposition chamber, wherein the atmospheric plasma treatment station comprises:
an enclosed controlled environment for receiving the semiconductor substrate, the enclosed controlled environment having an inert gas flow;
a track positioned above the semiconductor substrate within the enclosed controlled environment;
and
a linear head movable along the track, wherein the linear head is configured to direct the atmospheric plasma to specified regions of the semiconductor substrate.

5 more elements

A method of treating a surface condition of a semiconductor substrate with an atmospheric plasma, the method comprising:

receiving a semiconductor substrate in a semiconductor process tool including an atmospheric plasma treatment station and a deposition chamber;
and
transferring the semiconductor substrate to the deposition chamber, wherein transferring the semiconductor substrate to the deposition chamber includes:
exposing the semiconductor substrate to an atmospheric plasma in the atmospheric plasma treatment station prior to deposition in the deposition chamber, wherein the atmospheric plasma treatment station includes an enclosed controlled environment having an inert gas flow, a track positioned above the semiconductor substrate within the enclosed controlled environment, and a linear head movable along the track, wherein the linear head is configured to direct the atmospheric plasma to specified regions of the semiconductor substrate.

1 more element

Dependencies are inferred from the claim text.

Integrated atmospheric plasma treatment station in processing tool

Life of this patent

Integrated atmospheric plasma treatment station in processing tool

Life of this patent

Abstract

Claims20