C23C 18/1653
Two or more layers with at least one layer obtained by electroless
Official title: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}
C23C18/1653 (Two or more layers with at least one layer obtained by electroless) appears on 658 US grants and 1,000 published applications in this corpus.
Search patents in C23C- Granted patents
- 658
- Published applications
- 1,000
- Assignees
- 498
- Inventors
- 2,206
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 4 |
| 2002 | 10 | 13 |
| 2003 | 12 | 23 |
| 2004 | 13 | 22 |
| 2005 | 8 | 33 |
| 2006 | 14 | 30 |
| 2007 | 8 | 39 |
| 2008 | 9 | 24 |
| 2009 | 11 | 33 |
| 2010 | 15 | 45 |
| 2011 | 21 | 33 |
| 2012 | 25 | 38 |
| 2013 | 13 | 31 |
| 2014 | 21 | 45 |
| 2015 | 27 | 57 |
| 2016 | 37 | 105 |
| 2017 | 37 | 57 |
| 2018 | 47 | 51 |
| 2019 | 49 | 48 |
| 2020 | 35 | 62 |
| 2021 | 34 | 42 |
| 2022 | 36 | 32 |
| 2023 | 28 | 48 |
| 2024 | 31 | 42 |
| 2025 | 25 | 24 |
| 2026 | 9 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Integrated atmospheric plasma treatment station in processing tool2 Jun 2026US 12,648,418 B2Lam Research Corporation
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Structures for low temperature bonding using nanoparticles24 Feb 2026US 12,564,086 B2Adeia Semiconductor Technologies LLC
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Electroless plating processes197US 6,861,097 B1Shipley Company, L.L.C. · 2005
- Oled fiber light source150US 6,538,375 B1General Electric Company · 2003
- Method of metallizing high aspect ratio apertures124US 5,576,052 AMotorola, Inc. · 1996