C23C 18/1608
From pretreatment step, i.e. selective pre-treatment
Official title: {from pretreatment step, i.e. selective pre-treatment}
C23C18/1608 (From pretreatment step, i.e. selective pre-treatment) appears on 463 US grants and 589 published applications in this corpus.
Search patents in C23C- Granted patents
- 463
- Published applications
- 589
- Assignees
- 307
- Inventors
- 1,347
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 9 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 0 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 6 |
| 2002 | 9 | 8 |
| 2003 | 7 | 8 |
| 2004 | 9 | 17 |
| 2005 | 6 | 47 |
| 2006 | 9 | 33 |
| 2007 | 13 | 35 |
| 2008 | 11 | 25 |
| 2009 | 17 | 32 |
| 2010 | 17 | 30 |
| 2011 | 19 | 20 |
| 2012 | 18 | 15 |
| 2013 | 12 | 19 |
| 2014 | 21 | 31 |
| 2015 | 16 | 47 |
| 2016 | 19 | 55 |
| 2017 | 27 | 28 |
| 2018 | 27 | 20 |
| 2019 | 16 | 29 |
| 2020 | 16 | 20 |
| 2021 | 15 | 15 |
| 2022 | 11 | 13 |
| 2023 | 10 | 15 |
| 2024 | 5 | 9 |
| 2025 | 7 | 7 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Resin composition for laser direct structuring, molded article, and, method for manufacturing plated molded article30 Dec 2025US 12,509,549 B2Mitsubishi Chemical Corporation
- Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device16 Dec 2025US 12,500,148 B2STMicroelectronics S,r.l.
- Catalyst solution for electroless plating devoid of an amine4 Nov 2025US 12,460,301 B2The Boeing Company
- Semiconductor package23 Sep 2025US 12,426,164 B2Resonac Corporation
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Thermoplastic resin composition, molded article, and component for telecommunication apparatus30 Apr 2026US 2026/0117042 A1Asahi Kasei Kabushiki Kaisha
- Metal Plating of 3D Objects Printed with Catalyst Precursor Resin29 Jan 2026US 2026/0027769 A1Elektrum Technologies, Inc.
- Metal Particle-Free Catalytic Precursor Ink for Electroless Plating29 Jan 2026US 2026/0028496 A1Elektrum Technologies, Inc.
- Resin liquid and method of forming shaped object15 Jan 2026US 2026/0015470 A1Eeja Ltd.
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Copper metallization of USLI by electroless process269US 6,180,523 B2Industrial Technology Research Institute · 2001
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- High resolution patterning on solid substrates236US 5,079,600 A1992