C23C 18/1607
By direct patterning
Official title: {by direct patterning}
C23C18/1607 (By direct patterning) appears on 613 US grants and 758 published applications in this corpus.
Search patents in C23C- Granted patents
- 613
- Published applications
- 758
- Assignees
- 374
- Inventors
- 1,708
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 4 | 0 |
| 1978 | 10 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 13 | 0 |
| 1996 | 10 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 5 | 0 |
| 2001 | 14 | 6 |
| 2002 | 12 | 12 |
| 2003 | 10 | 13 |
| 2004 | 15 | 25 |
| 2005 | 8 | 61 |
| 2006 | 17 | 38 |
| 2007 | 16 | 41 |
| 2008 | 13 | 32 |
| 2009 | 19 | 38 |
| 2010 | 23 | 39 |
| 2011 | 27 | 32 |
| 2012 | 23 | 30 |
| 2013 | 19 | 22 |
| 2014 | 26 | 41 |
| 2015 | 26 | 55 |
| 2016 | 26 | 65 |
| 2017 | 35 | 34 |
| 2018 | 33 | 29 |
| 2019 | 21 | 35 |
| 2020 | 22 | 30 |
| 2021 | 20 | 20 |
| 2022 | 14 | 15 |
| 2023 | 13 | 19 |
| 2024 | 6 | 9 |
| 2025 | 7 | 12 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Resin composition for laser direct structuring, molded article, and, method for manufacturing plated molded article30 Dec 2025US 12,509,549 B2Mitsubishi Chemical Corporation
- Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device16 Dec 2025US 12,500,148 B2STMicroelectronics S,r.l.
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Thermoplastic resin composition, molded article, and component for telecommunication apparatus30 Apr 2026US 2026/0117042 A1Asahi Kasei Kabushiki Kaisha
- Metal Plating of 3D Objects Printed with Catalyst Precursor Resin29 Jan 2026US 2026/0027769 A1Elektrum Technologies, Inc.
- Metal Particle-Free Catalytic Precursor Ink for Electroless Plating29 Jan 2026US 2026/0028496 A1Elektrum Technologies, Inc.
- Resin liquid and method of forming shaped object15 Jan 2026US 2026/0015470 A1Eeja Ltd.
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Vacuum-integrated hardmask processes and apparatus389US 9,778,561 B2Lam Research Corporation · 2017
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995