C23C 18/1612
Through irradiation means
Official title: {through irradiation means}
C23C18/1612 (Through irradiation means) appears on 253 US grants and 260 published applications in this corpus.
Search patents in C23C- Granted patents
- 253
- Published applications
- 260
- Assignees
- 175
- Inventors
- 691
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 9 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 8 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 2 |
| 2002 | 3 | 2 |
| 2003 | 1 | 0 |
| 2004 | 3 | 9 |
| 2005 | 1 | 16 |
| 2006 | 5 | 5 |
| 2007 | 4 | 9 |
| 2008 | 5 | 6 |
| 2009 | 4 | 3 |
| 2010 | 4 | 8 |
| 2011 | 7 | 12 |
| 2012 | 4 | 7 |
| 2013 | 5 | 5 |
| 2014 | 6 | 14 |
| 2015 | 13 | 29 |
| 2016 | 10 | 33 |
| 2017 | 13 | 23 |
| 2018 | 22 | 10 |
| 2019 | 9 | 15 |
| 2020 | 10 | 11 |
| 2021 | 9 | 8 |
| 2022 | 6 | 9 |
| 2023 | 7 | 11 |
| 2024 | 3 | 4 |
| 2025 | 3 | 6 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Resin composition for laser direct structuring, molded article, and, method for manufacturing plated molded article30 Dec 2025US 12,509,549 B2Mitsubishi Chemical Corporation
- Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device16 Dec 2025US 12,500,148 B2STMicroelectronics S,r.l.
- Semiconductor package23 Sep 2025US 12,426,164 B2Resonac Corporation
- Thermoplastic resin composition, molded article, and component for telecommunication apparatus30 Apr 2026US 2026/0117042 A1Asahi Kasei Kabushiki Kaisha
- Metal Particle-Free Catalytic Precursor Ink for Electroless Plating29 Jan 2026US 2026/0028496 A1Elektrum Technologies, Inc.
- Resin liquid and method of forming shaped object15 Jan 2026US 2026/0015470 A1Eeja Ltd.
- Intermediate articles having catalytic ink18 Dec 2025US 2025/0381555 A1Eastman Kodak Company
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof20 Nov 2025US 2025/0354267 A1Zhejiang University
Most cited
By later US patents
- Vacuum-integrated hardmask processes and apparatus389US 9,778,561 B2Lam Research Corporation · 2017
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- High resolution patterning on solid substrates236US 5,079,600 A1992
- Method for photo-forming small shaped metal containing articles from porous precursors136US 5,512,162 AMassachusetts Institute of Technology · 1996
- Deep ultraviolet photolithographically defined ultra-thin films for selective cell adhesion and outgrowth and method of manufacturing the same and devices containing the same119US 5,324,591 AGeo-Centers, Inc. · 1994