Resin composition for laser direct structuring, molded article, and, method for manufacturing plated molded article
AssigneeMitsubishi Chemical Corporation
InventorTatsuya Kikuchi
Life of this patent
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Abstract
Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of R1 and R2 independently represents a hydrogen atom or a methyl group, and W1 represents a single bond or a divalent group).
Claims20
A resin composition for laser direct structuring, comprising:
- a polycarbonate resin;
- and
- a laser direct structuring additive,
- wherein the polycarbonate resin comprises 5% by mass or more, relative to all structural units, of a structural unit of formula (1),
- wherein R1 and R2 are each independently a hydrogen atom or a methyl group, and W1 is a single bond or a divalent group, and
- a content of the laser direct structuring additive, per 100 parts by mass of the polycarbonate resin, is 18 parts by mass or more and 150 parts by mass or less.
Dependencies are inferred from the claim text.