US 2026/0028496 A1 · Metal Particle-Free Catalytic Precursor Ink for Electroless Plating

Abstract

A method for making electrically conductive patterns using a metal particle-free ink containing a catalyst precursor that subsequently forms catalytic seed nanoparticles in-situ during or after a patterning step. The catalytic pattern is fixed on the target substrate after which catalytic sites are generated by reduction of the precursor to metallic particles. The reductant is selected to minimize particle generation under ambient conditions but the reduction of the catalyst precursors in the ink may be accelerated by an external input such as heat or ultraviolet energy. This catalytic pattern is then metallized with electroless plating to generate a conductive metallic pattern corresponding to the first catalyst pattern.

Claims20

Dependent claims

A method for making a conductive pattern comprising:

depositing a first pattern on a substrate using a metal particle-free precursor ink, wherein the ink comprises:
monomers, oligomers, or polymers;
reducible metal ions or metal complexes;
a photoinitiator;
a reducing agent;
and
a chelating agent or ligand;
curing the first pattern, by at least partially solidifying the pattern;
generating catalytic nanoparticles within the first pattern by reduction of at least a portion of the metal ions or metal complexes;
and
plating the first pattern using electroless chemistry to form a conductive pattern.

8 more elements

Dependencies are inferred from the claim text.

Metal Particle-Free Catalytic Precursor Ink for Electroless Plating

Life of this patent

Metal Particle-Free Catalytic Precursor Ink for Electroless Plating

Life of this patent

Abstract

Claims20