C23C 18/161
From plating step
Official title: {from plating step, e.g. inkjet}
C23C18/161 (From plating step) appears on 88 US grants and 97 published applications in this corpus.
Search patents in C23C- Granted patents
- 88
- Published applications
- 97
- Assignees
- 83
- Inventors
- 246
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 3 |
| 2004 | 2 | 4 |
| 2005 | 1 | 11 |
| 2006 | 6 | 5 |
| 2007 | 0 | 4 |
| 2008 | 1 | 4 |
| 2009 | 2 | 6 |
| 2010 | 2 | 4 |
| 2011 | 7 | 5 |
| 2012 | 2 | 3 |
| 2013 | 6 | 2 |
| 2014 | 3 | 6 |
| 2015 | 4 | 6 |
| 2016 | 4 | 9 |
| 2017 | 5 | 3 |
| 2018 | 4 | 3 |
| 2019 | 4 | 4 |
| 2020 | 2 | 4 |
| 2021 | 3 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 3 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Catalyst solution for electroless plating devoid of an amine4 Nov 2025US 12,460,301 B2The Boeing Company
- Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor6 Jun 2023US 11,668,008 B2TDK Corporation
- Deposition mask and method of manufacturing the same10 May 2022US 11,326,258 B2LG Display Co., Ltd.
- Structure containing Sn layer or Sn alloy layer6 Jul 2021US 11,052,637 B2Ishihara Chemical Co., Ltd.
- Metal Particle-Free Catalytic Precursor Ink for Electroless Plating29 Jan 2026US 2026/0028496 A1Elektrum Technologies, Inc.
- Metal compound thin film, method of forming the same and thin flim catalyst for water electrolysis1 May 2025US 2025/0137139 A1National Sun Yat-Sen University
- Catalyst ink for plating and electroless plating method using same31 Oct 2024US 2024/0360331 A1Korea Electrotechnology Research Institute
- Catalyst solution for electroless plating devoid of an amine21 Sep 2023US 2023/0295808 A1The Boeing Company
- Direct Printing of Catalyst Inks18 May 2023US 2023/0151492 A1
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating247US 5,846,598 AInternational Business Machines Corporation · 1998
- Method for manufacturing raised electrical contact pattern of controlled geometry196US 6,215,670 B1FormFactor, Inc. · 2001
- Method of making raised contacts on electronic components144US 5,852,871 AForm Factor, Inc. · 1998