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US 11,668,008 B2Granted
Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
AssigneeTDK Corporation
InventorsMakoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi, Hisayuki Abe
Life of this patent
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Abstract
A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
Claims11
A sheet material comprising:
- a resin layer comprising a binder and a plurality of catalyst particles;
- an electroless plating film provided on a side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film;
- and
- a base material provided on a side of an other main surface of the resin layer, wherein:
- at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the exposure surfaces are scattered on the one main surface of the resin layer,
- the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the exposure surfaces of the catalyst particles and to cover a portion of the one main surface of the resin layer that is less than an entirety of the one main surface of the resin layer, and
- the second electroless plating film is in direct contact with the one main surface of the resin layer at portions of the one main surface of the resin layer not covered by the first electroless plating films, and the second electroless plating film covering the first electroless plating films such that a main surface of the second electroless plating film on a side of the first electroless plating films forms concave portions, respectively, along surfaces of the first electroless plating films.
4 more elements
A metal mesh comprising:
- a resin layer comprising a binder and a plurality of catalyst particles;
- an electroless plating film having a mesh-shaped pattern on a side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film;
- and
- a base material provided on a side of an other main surface of the resin layer, wherein:
- at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the exposure surfaces are scattered on the one main surface of the resin layer,
- the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the exposure surfaces of the catalyst particles and to cover a portion of the one main surface of the resin layer that is less than an entirety of the one main surface of the resin layer, and
- the second electroless plating film is in direct contact with the one main surface of the resin layer at portions of the one main surface of the resin layer not covered by the first electroless plating films, and the second electroless plating film covering the first electroless plating films such that a main surface of the second electroless plating film on a side of the first electroless plating films forms concave portions, respectively, along surfaces of the first electroless plating films.
4 more elements
A metal mesh comprising:
- a base material;
- a resin layer having a mesh-shaped pattern on the base material, that does not cover all of the base material, and comprising a binder and a plurality of catalyst particles;
- and
- an electroless plating film provided on the base material along the mesh-shaped pattern of the resin layer while covering the resin layer and comprising first electroless plating films and a second electroless plating film, wherein:
- at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from a surface of the resin layer, and the exposure surfaces are scattered on the surface of the resin layer,
- the first electroless plating films are provided on the surface of the resin layer to respectively surround the exposure surfaces of the catalyst particles and to cover a portion of the surface of the resin layer that is less than an entirety of the surface of the resin layer, and
- the second electroless plating film is in direct contact with the surface of the resin layer at portions of the surface of the resin layer not covered by the first electroless plating films, and the second electroless plating film covering the first electroless plating films such that a main surface of the second electroless plating film on a side of the first electroless plating films forms concave portions, respectively, along surfaces of the first electroless plating films.
4 more elements
A wiring substrate comprising:
- a resin layer comprising a binder and a plurality of catalyst particles;
- an electroless plating film having a wiring pattern on a side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film;
- and
- a base material provided on a side of an other main surface of the resin layer, wherein:
- at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the exposure surfaces are scattered on the one main surface of the resin layer,
- the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the exposure surfaces of the catalyst particles and to cover a portion of the one main surface of the resin layer that is less than an entirety of the one main surface of the resin layer, and
- the second electroless plating film is in direct contact with the one main surface of the resin layer at portions of the one main surface of the resin layer not covered by the first electroless plating films, and the second electroless plating film covering the first electroless plating films such that a main surface of the second electroless plating film on a side of the first electroless plating films forms concave portions, respectively, along surfaces of the first electroless plating films.
4 more elements
A wiring substrate comprising:
- a base material;
- a resin layer having a wiring pattern on the base material, that does not cover all of the base material, and comprising a binder and a plurality of catalyst particles;
- and
- an electroless plating film provided on the base material along the wiring pattern of the resin layer while covering the resin layer and comprising first electroless plating films and a second electroless plating film, wherein:
- at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from a surface of the resin layer, and the exposure surfaces are scattered on the surface of the resin layer,
- the first electroless plating films are provided on the surface of the resin layer to respectively surround the exposure surfaces of the catalyst particles and to cover a portion of the surface of the resin layer that is less than an entirety of the surface of the resin layer, and
- the second electroless plating film is in direct contact with the surface of the resin layer at portions of the surface of the resin layer not covered by the first electroless plating films, and the second electroless plating film covering the first electroless plating films such that a main surface of the second electroless plating film on a side of the first electroless plating films forms concave portions, respectively, along surfaces of the first electroless plating films.
4 more elements
Dependencies are inferred from the claim text.