C23C 16/4409
Characterised by sealing means
Official title: {characterised by sealing means}
C23C16/4409 (Characterised by sealing means) appears on 294 US grants and 393 published applications in this corpus.
Search patents in C23C- Granted patents
- 294
- Published applications
- 393
- Assignees
- 167
- Inventors
- 964
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 17 | 0 |
| 2001 | 5 | 3 |
| 2002 | 7 | 10 |
| 2003 | 4 | 13 |
| 2004 | 7 | 10 |
| 2005 | 5 | 8 |
| 2006 | 4 | 10 |
| 2007 | 2 | 13 |
| 2008 | 2 | 11 |
| 2009 | 2 | 6 |
| 2010 | 10 | 11 |
| 2011 | 5 | 11 |
| 2012 | 7 | 2 |
| 2013 | 9 | 7 |
| 2014 | 1 | 11 |
| 2015 | 11 | 21 |
| 2016 | 12 | 21 |
| 2017 | 11 | 20 |
| 2018 | 11 | 12 |
| 2019 | 13 | 31 |
| 2020 | 22 | 21 |
| 2021 | 15 | 22 |
| 2022 | 15 | 18 |
| 2023 | 13 | 28 |
| 2024 | 25 | 22 |
| 2025 | 26 | 27 |
| 2026 | 7 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heated lid for a process chamber25 Aug 2026US 12,721,087 B2APPLIED Materials.Inc.
- Method of particle abatement in a semiconductor processing apparatus4 Aug 2026US 12,698,562 B2ASM IP Holding B. V.
- Ultra high purity conditions for atomic scale processing28 Apr 2026US 12,614,696 B2Kurt J. Lesker Company
- Electrode filament connection member, chemical vapor deposition apparatus, and method for manufacturing recording medium substrate21 Apr 2026US 12,606,914 B2Resonac Hard Disk Corporation
- Atomic layer deposition device for uniform coating on inner surface of dome shaped surface27 Jan 2026US 12,534,804 B2Harbin Institute of Technology
- Device and method for mist chemical vapor deposition of large-size semiconductor thin film8 Oct 2026US 2026/0308759 A1Tiangong University
- Sealing system for a reactor system1 Oct 2026US 2026/0297738 A1ASM IP Holding B. V.
- Ultra High Purity Conditions for Atomic Scale Processing27 Aug 2026US 2026/0253839 A1Kurt J. Lesker Company
- Single-chamber atomic layer deposition apparatus with dual-lid closure system20 Aug 2026US 2026/0242946 A1Swiss Cluster AG
- Apparatus For Depositing Material Layers on a Substrate23 Jul 2026US 2026/0209932 A1
Most cited
By later US patents
- Process feed management for semiconductor substrate processing741US 9,017,481 B1ASM America, Inc. · 2015
- Method and apparatus for aligning and supporting semiconductor process gas delivery and regulation components581US 5,732,744 AControl Systems, Inc. · 1998
- Source chemical container assembly561US 6,889,864 B2ASM International N.V. · 2005
- Chamber sealing member553US 9,005,539 B2ASM IP Holding B. V. · 2015
- Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems529US 7,682,454 B2Sundew Technologies, LLC · 2010