C23C 16/36
Carbonitrides
C23C16/36 (Carbonitrides) appears on 705 US grants and 814 published applications in this corpus.
Search patents in C23C- Granted patents
- 705
- Published applications
- 814
- Assignees
- 184
- Inventors
- 1,241
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 9 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 4 |
| 2002 | 9 | 10 |
| 2003 | 8 | 12 |
| 2004 | 10 | 21 |
| 2005 | 7 | 13 |
| 2006 | 8 | 16 |
| 2007 | 12 | 27 |
| 2008 | 11 | 17 |
| 2009 | 12 | 19 |
| 2010 | 18 | 24 |
| 2011 | 20 | 16 |
| 2012 | 13 | 22 |
| 2013 | 19 | 16 |
| 2014 | 19 | 29 |
| 2015 | 16 | 49 |
| 2016 | 32 | 39 |
| 2017 | 47 | 51 |
| 2018 | 36 | 41 |
| 2019 | 34 | 49 |
| 2020 | 39 | 64 |
| 2021 | 44 | 55 |
| 2022 | 56 | 57 |
| 2023 | 37 | 49 |
| 2024 | 45 | 52 |
| 2025 | 51 | 36 |
| 2026 | 19 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium6 Oct 2026US 12,757,653 B2Kokusai Electric Corporation
- Coated cutting tool1 Sep 2026US 12,722,206 B2AB Sandvik Coromant
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium7 Jul 2026US 12,677,612 B2Kokusai Electric Corporation
- Substrate-processing method16 Jun 2026US 12,654,198 B2Tokyo Electron Limited
- Methods for atomic layer deposition of SiCO(N) using halogenated silyl amides2 Jun 2026US 12,644,180 B2APPLIED Materials.Inc.
- Surface coated cutting tool17 Sep 2026US 2026/0275509 A1Mitsubishi Materials Corporation
- Coated cutting tool3 Sep 2026US 2026/0257279 A1Tungaloy Corporation
- Methods for atomic layer deposition of sico(n) using halogenated silylamides3 Sep 2026US 2026/0258553 A1APPLIED Materials.Inc.
- Substrate processing method and substrate processing system27 Aug 2026US 2026/0250842 A1Tokyo Electron Limited
- Method for creating thermally conductive, electrically insulating materials20 Aug 2026US 2026/0242930 A1United Protective Technologies, LLC
Most cited
By later US patents
- Method of forming conformal film having si-N bonds on high-aspect ratio pattern597US 8,394,466 B2ASM Japan K .K. · 2013
- Dopant precursors and processes596US 6,743,738 B2ASM America, Inc. · 2004
- Method for forming silazane-based dielectric film592US 7,651,959 B2ASM Japan K .K. · 2010
- CVD of silicon-based ceramic materials on internal surface of a reactor587US 5,413,813 AEnichem S.p.A. · 1995
- Plasma pre-treating surfaces for atomic layer deposition548US 7,498,242 B2ASM America, Inc. · 2009