Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

A substrate processing apparatus comprising:

• a precursor supply system configured to supply a precursor containing silicon, nitrogen and carbon to the substrate;
• an oxidant supply system configured to supply an oxidant to the substrate;
• a heater configured to heat the substrate;
• and
• a controller configured to be capable of controlling the precursor supply system, the oxidant supply system and the heater so as to:
• form a film containing silicon, oxygen, carbon and nitrogen on the substrate by performing a cycle multiple times, the cycle including:
• forming a layer containing silicon, oxygen, carbon and nitrogen by supplying the precursor and the oxidant to the substrate;
• and
• performing a first modifying process to the layer at a first temperature to desorb impurities contained in the layer and densify the layer;
• and
• perform, after forming the film by performing the cycle multiple times, a second modifying process to the film at a second temperature that is not less than the first temperature to desorb impurities contained in the film and densify the film.

A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising:

• forming a film containing silicon, oxygen, carbon and nitrogen on a substrate by performing a cycle multiple times, the cycle including:
• forming a layer containing silicon, oxygen, carbon and nitrogen by supplying a precursor containing silicon, nitrogen and carbon and an oxidant to the substrate;
• and
• performing a first modifying process to the layer at a first temperature to desorb impurities contained in the layer and densify the layer;
• and
• performing, after forming the film by performing the cycle multiple times, a second modifying process to the film at a second temperature that is not less than the first temperature to desorb impurities contained in the film and densify the film.