C23C 16/16
From metal carbonyl compounds
Official title: from metal carbonyl compounds
C23C16/16 (From metal carbonyl compounds) appears on 253 US grants and 334 published applications in this corpus.
Search patents in C23C- Granted patents
- 253
- Published applications
- 334
- Assignees
- 109
- Inventors
- 660
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 3 | 0 |
| 2002 | 4 | 8 |
| 2003 | 3 | 6 |
| 2004 | 2 | 9 |
| 2005 | 7 | 19 |
| 2006 | 10 | 24 |
| 2007 | 12 | 25 |
| 2008 | 9 | 16 |
| 2009 | 6 | 13 |
| 2010 | 10 | 11 |
| 2011 | 8 | 15 |
| 2012 | 8 | 14 |
| 2013 | 12 | 6 |
| 2014 | 11 | 10 |
| 2015 | 7 | 17 |
| 2016 | 9 | 16 |
| 2017 | 7 | 7 |
| 2018 | 10 | 14 |
| 2019 | 7 | 15 |
| 2020 | 13 | 11 |
| 2021 | 9 | 13 |
| 2022 | 5 | 13 |
| 2023 | 11 | 18 |
| 2024 | 10 | 17 |
| 2025 | 15 | 10 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Embedding method and processing system29 Sep 2026US 12,751,259 B2Tokyo Electron Limited
- Selective cobalt deposition on copper surfaces14 Jul 2026US 12,680,158 B2APPLIED Materials.Inc.
- Method and materials for creating patterns of carbon and/or other elements on substrates or within liquid or frozen media by directed energy deposition of carbon and other elements21 Apr 2026US 12,606,902 B2
- Source gas supply method, source gas supply mechanism, and film forming system10 Mar 2026US 12,571,104 B2Tokyo Electron Limited
- Semiconductor arrangement and method of making24 Feb 2026US 12,564,024 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Nitrogen gettering from a metal by use of a selectively deposited metal13 Aug 2026US 2026/0239941 A1APPLIED Materials.Inc.
- Halide-free co-reactants for ruthenium film deposition6 Aug 2026US 2026/0226611 A1APPLIED Materials.Inc.
- Method for manufacturing thin film2 Jul 2026US 2026/0185227 A1Daikin Industries, Ltd.
- Semiconductor arrangement and method of making2 Jul 2026US 2026/0190959 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Deposition of halide-free metal films using noble metal catalysts25 Jun 2026US 2026/0176747 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Precursor source mixtures666US 6,984,591 B1International Business Machines Corporation · 2006
- Solid precursor-based delivery of fluid utilizing controlled solids morphology537US 8,821,640 B2Advanced Technology Materials, Inc. · 2014
- Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces150US 6,302,965 B1APPLIED Materials.Inc. · 2001
- Method for depositing refractory metal layers employing sequential deposition techniques147US 6,797,340 B2APPLIED Materials.Inc. · 2004
- Fine powders and method for manufacturing122US 5,876,793 AUltramet · 1999