C23C 16/06
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of
Official title: characterised by the deposition of metallic material
C23C16/06 (Chemical coating by decomposition of gaseous compounds, without leaving reaction products of) appears on 2,760 US grants and 3,301 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,760
- Published applications
- 3,301
- Assignees
- 865
- Inventors
- 5,491
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 6 | 0 |
| 1983 | 2 | 0 |
| 1984 | 8 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 13 | 0 |
| 1989 | 13 | 0 |
| 1990 | 30 | 0 |
| 1991 | 19 | 0 |
| 1992 | 26 | 0 |
| 1993 | 28 | 0 |
| 1994 | 31 | 0 |
| 1995 | 35 | 0 |
| 1996 | 26 | 0 |
| 1997 | 19 | 0 |
| 1998 | 39 | 0 |
| 1999 | 55 | 0 |
| 2000 | 76 | 0 |
| 2001 | 71 | 31 |
| 2002 | 75 | 81 |
| 2003 | 59 | 80 |
| 2004 | 57 | 66 |
| 2005 | 60 | 87 |
| 2006 | 46 | 111 |
| 2007 | 55 | 99 |
| 2008 | 49 | 90 |
| 2009 | 54 | 108 |
| 2010 | 73 | 94 |
| 2011 | 54 | 84 |
| 2012 | 67 | 102 |
| 2013 | 62 | 105 |
| 2014 | 88 | 106 |
| 2015 | 92 | 152 |
| 2016 | 99 | 181 |
| 2017 | 115 | 157 |
| 2018 | 121 | 167 |
| 2019 | 137 | 151 |
| 2020 | 124 | 172 |
| 2021 | 118 | 156 |
| 2022 | 129 | 213 |
| 2023 | 116 | 215 |
| 2024 | 129 | 182 |
| 2025 | 148 | 171 |
| 2026 | 109 | 140 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Embedding method and processing system29 Sep 2026US 12,751,259 B2Tokyo Electron Limited
- Thermal interface materials comprising aligned fibers and materials such as solder, alloys, and/or other metals15 Sep 2026US 12,735,838 B2Boston Materials, Inc.
- Film forming method, film forming device, and method for manufacturing semiconductor device8 Sep 2026US 12,729,423 B2Tokyo Electron Limited
- Metal-on-metal deposition methods for filling a gap feature on a substrate surface8 Sep 2026US 12,729,430 B2ASM IP Holding B. V.
- Conductive structures and methods of forming the same8 Sep 2026US 12,733,465 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Conductive structures and methods of forming the same8 Oct 2026US 2026/0314355 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Topology-selective deposition method and structure formed using same1 Oct 2026US 2026/0297730 A1ASM IP Holding B. V.
- Collecting apparatus and collecting method1 Oct 2026US 2026/0297739 A1Jusung Engineering Co., Ltd.
- Semiconductor device and method for forming the same1 Oct 2026US 2026/0304794 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Metallic coated polymeric seal for use in medical applications24 Sep 2026US 2026/0283644 A1Vernay Laboratories, Inc.
Most cited
By later US patents
- Production of elemental thin films using a boron-containing reducing agent809US 6,475,276 B1ASM Microchemistry Oy · 2002
- Precursor source mixtures666US 6,984,591 B1International Business Machines Corporation · 2006
- Selective formation of metallic films on metallic surfaces573US 8,956,971 B2ASM International N.V. · 2015
- Metal silicide, metal germanide, methods for making the same559US 9,129,897 B2ASM International N.V. · 2015
- Periodic plasma annealing in an ALD-type process543US 7,713,874 B2ASM America, Inc. · 2010