C23C 16/0281
Of metallic sub-layers
Official title: {of metallic sub-layers (C23C16/029 takes precedence)}
C23C16/0281 (Of metallic sub-layers) appears on 442 US grants and 512 published applications in this corpus.
Search patents in C23C- Granted patents
- 442
- Published applications
- 512
- Assignees
- 262
- Inventors
- 1,275
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 18 | 0 |
| 2001 | 18 | 6 |
| 2002 | 17 | 23 |
| 2003 | 9 | 15 |
| 2004 | 15 | 16 |
| 2005 | 11 | 21 |
| 2006 | 5 | 14 |
| 2007 | 12 | 20 |
| 2008 | 10 | 16 |
| 2009 | 10 | 14 |
| 2010 | 20 | 20 |
| 2011 | 10 | 19 |
| 2012 | 16 | 18 |
| 2013 | 18 | 21 |
| 2014 | 6 | 16 |
| 2015 | 16 | 21 |
| 2016 | 7 | 21 |
| 2017 | 20 | 20 |
| 2018 | 15 | 19 |
| 2019 | 16 | 27 |
| 2020 | 18 | 22 |
| 2021 | 19 | 30 |
| 2022 | 21 | 25 |
| 2023 | 18 | 29 |
| 2024 | 22 | 28 |
| 2025 | 19 | 16 |
| 2026 | 8 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including s-shaped staggered contacts8 Sep 2026US 12,729,429 B2APPLIED Materials.Inc.
- Method for manufacturing group III nitride semiconductor substrate14 Apr 2026US 12,604,680 B2Sumco Corporation
- Methods and apparatus for tungsten gap fill17 Mar 2026US 12,577,658 B2APPLIED Materials.Inc.
- Vehicle braking components including an adhesion layer17 Mar 2026US 12,577,994 B2GM Global Technology Operations LLC
- Integrated methods for graphene formation10 Mar 2026US 12,571,092 B2APPLIED Materials.Inc.
- Ruthenium seeding for corrosion free molybdenum growth17 Sep 2026US 2026/0282856 A1APPLIED Materials.Inc.
- Integrated substrate processing apparatus and method20 Aug 2026US 2026/0245835 A1Picosun Oy
- Pulse ald sequence for low fluorine wn deposition16 Jul 2026US 2026/0206502 A1Lam Research Corporation
- Feature fill using inhibition16 Jul 2026US 2026/0206557 A1Lam Research Corporation
- Selective deposition of silicon oxide on metal surfaces18 Jun 2026US 2026/0168088 A1ASM IP Holding B. V.
Most cited
By later US patents
- Aligned carbon nanotubes418US 10,343,920 B2ASM IP Holding B. V. · 2019
- Deposition of copper with increased adhesion299US 6,171,661 B2APPLIED Materials.Inc. · 2001
- Tantalum nitride CVD deposition by tantalum oxide densification285US 6,638,810 B2APPLIED Materials.Inc. · 2003
- Low resistivity W using B2H6 nucleation step222US 6,206,967 B1APPLIED Materials.Inc. · 2001
- Method for forming metal layer of semiconductor device using metal halide gas200US 6,458,701 B1Samsung Electronics Co., Ltd. · 2002