Integrated substrate processing apparatus and method

Abstract

An integrated substrate processing apparatus (100) comprises substrate modules integrated, under vacuum, via a wafer handling module (150). The substrate modules comprise a first substrate processing module (110) provided with a remote plasma generator (115), configured to process one substrate (101) at a time in a plasma-enhanced process, and a second substrate processing module (120) capable of processing at least one batch of substrates (101) in a thermal mode for thin film deposition, said second substrate processing module (120) comprising a heated substrate support (215).

Dependencies are inferred from the claim text.