B81C 2203/054
Using structural alignment aids
Official title: using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls
B81C2203/054 (Using structural alignment aids) appears on 51 US grants and 59 published applications in this corpus.
Search patents in B81C- Granted patents
- 51
- Published applications
- 59
- Assignees
- 40
- Inventors
- 136
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 4 |
| 2013 | 2 | 4 |
| 2014 | 3 | 4 |
| 2015 | 5 | 6 |
| 2016 | 5 | 3 |
| 2017 | 5 | 1 |
| 2018 | 4 | 3 |
| 2019 | 1 | 2 |
| 2020 | 4 | 5 |
| 2021 | 5 | 4 |
| 2022 | 2 | 1 |
| 2023 | 1 | 5 |
| 2024 | 1 | 4 |
| 2025 | 1 | 2 |
| 2026 | 6 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer level proximity sensor and method of making same16 Jun 2026US 12,655,017 B2STMicroelectronics International N. V.
- Die stacking with controlled angular alignment28 Apr 2026US 12,612,306 B2STMicroelectronics International N. V.
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Die stacking with controlled tilt and angular alignment31 Mar 2026US 12,589,990 B2STMicroelectronics International N. V.
- Sensor assembly and methods of manufacturing thereof17 Feb 2026US 12,553,751 B2APPLIED Materials.Inc.
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
- Packaging for a sensor and methods of manufacturing thereof5 Feb 2026US 2026/0036454 A1APPLIED Materials.Inc.
- Methods of fabricating micro electro-mechanical systems structures22 May 2025US 2025/0162860 A1The University of British Columbia
- Wafer level proximity sensor and method of making same2 Jan 2025US 2025/0002333 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Method and apparatus for the assembly of microfabricated devices153US 5,355,577 A1994
- Microfluidic structure assembly with mating microfeatures113US 5,932,315 AHewlett-Packard Company · 1999
- Flexure assemblies and methods of making the same13US 6,674,585 B1Siwave, Inc. · 2004
- Edge construction on optical devices8US 9,835,801 B1Mellanox Technologies Silicon Photonics Inc. · 2017
- Precision micromirror positioning6US 6,649,435 B2Texas Instruments Incorporated · 2003